Micro camera module and method of manufacturing the same

• US 20070019102A1
• Filed: 06/28/2006
• Published: 01/25/2007
• Est. Priority Date: 07/01/2005
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yoshikawa, Hiroshi, Hori, Akihiro, Sasaki, Michio, Nakajo, Hironori
• Granted Patent: US 7,728,398 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: H01L 2224/02372 connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05009 Bonding area integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/051 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13024 the bump connector being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A semiconductor chip constituting an image pickup device is provided on a substrate and includes a connection terminal and an image pickup portion. A lens sheet having a lens portion is provided on the semiconductor chip. A groove is formed in at least the substrate to expose the connection terminal. A conductor pattern is formed in the groove and has one end electrically connected to the connection terminal.

Claims

1. An image pickup device comprising:

a substrate;

a semiconductor chip provided on the substrate and including a connection terminal and an image pickup portion;

a lens sheet having a lens portion provided on the semiconductor chip;

a groove formed at least in the substrate to expose the connection terminal; and

a conductor pattern formed in the groove, one end of the conductor pattern being electrically connected to the connection terminal.

2. The device according to claim 1, further comprising a bonding layer formed between the substrate and the semiconductor chip and between the semiconductor chip and the lens sheet.

3. The device according to claim 1, wherein the bonding layer is an epoxy resin layer.

4. The device according to claim 1, wherein the connection terminal is provided on a back surface of the semiconductor chip.

5. The device according to claim 1, wherein the connection terminal is provided on a front surface of the semiconductor chip, and the groove is formed in the substrate and the semiconductor chip.

6. The device according to claim 1, further comprising a bump formed on the other end of the conductor pattern.

7. The device according to claim 1, further comprising a shielding film provided on the entire lens sheet except the lens portion.

8. An image pickup device comprising:

a semiconductor chip having a first connection terminal and an image pickup element portion on a front surface, and a second connection terminal on a back surface, the semiconductor chip internally having a conductor that connects the first and second connection terminals together; and

a lens sheet having a lens portion provided on the front surface of the semiconductor chip.

9. The device according to claim 8, further comprising a bonding layer formed between the semiconductor chip and the lens sheet.

10. The device according to claim 8, wherein the bonding layer is an epoxy resin layer.

11. The device according to claim 8, further comprising a bump formed on the second connection terminal.

12. The device according to claim 8, further comprising a shielding film provided on the entire lens sheet except the lens portion.

13. A method for manufacturing an image pickup device, the method comprising:

providing a substrate, a semiconductor wafer including a plurality of chips, and a lens sheet having a plurality of lens portions, each of the plurality of chips having an image pickup element portion and a connection terminal;

stacking the substrate, the semiconductor wafer, and the lens sheet to form a stacked member, a bonding layer being formed between the substrate and the semiconductor wafer and between the semiconductor wafer and the lens sheet;

forming a groove at least in the substrate so that the connection terminals of the plurality of chips are exposed; and

dicing the stacked member into chips.

14. The method according to claim 13, further comprising forming a conductor pattern in the groove, one end of the conductor pattern being connected to the connection terminal.

15. The method according to claim 14, further comprising forming a bump at the other end of the conductor pattern.

16. The method according to claim 13, wherein the bonding layer is an epoxy resin layer.

17. The method according to claim 13, wherein the connection terminal is provided on a back surface of the semiconductor chip.

18. The method according to claim 13, wherein the connection terminal is provided on a front surface of the semiconductor chip, and the groove is formed in the substrate and the semiconductor chip.

19. The method according to claim 13, wherein the substrate and the semiconductor wafer have almost the same diameter.

20. The method according to claim 13, wherein the plurality of lens portions of the lens sheet are stacked on the respective chips of the semiconductor wafer.