MEMS devices having overlying support structures and methods of fabricating the same
First Claim
1. A method of fabricating a MEMS device, comprising:
- providing a substrate;
depositing an electrode layer over the substrate;
depositing a sacrificial layer over the electrode layer;
patterning the sacrificial layer to form apertures;
depositing a movable layer over the sacrificial layer;
forming support structures overlying the movable layer and at least partially within apertures in the sacrificial layer; and
etching the sacrificial layer to remove the sacrificial layer, thereby forming a cavity between the movable layer and the electrode layer.
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Accused Products
Abstract
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
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Citations
65 Claims
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1. A method of fabricating a MEMS device, comprising:
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providing a substrate;
depositing an electrode layer over the substrate;
depositing a sacrificial layer over the electrode layer;
patterning the sacrificial layer to form apertures;
depositing a movable layer over the sacrificial layer;
forming support structures overlying the movable layer and at least partially within apertures in the sacrificial layer; and
etching the sacrificial layer to remove the sacrificial layer, thereby forming a cavity between the movable layer and the electrode layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A MEMS device, comprising:
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a substrate;
an electrode layer located over the substrate;
a movable layer located over the electrode layer, wherein the movable layer is generally spaced apart from the electrode layer by an air gap, and wherein the movable layer comprises depressions in support regions; and
rigid support structures formed over the movable layer and at least partially within the depressions in the movable layer. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. A MEMS device, comprising:
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first means for electrically conducting;
second means for electrically conducting; and
means for supporting said second conducting means over said first conducting means, wherein said supporting means overlie portions of the second means for electrically conducting, and wherein said second conducting means is movable relative to said first conducting means in response to generating electrostatic potential between said first and second conducting means. - View Dependent Claims (63, 64, 65)
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Specification