Cooling arrangement for a computer system

• US 20070019381A1
• Filed: 07/17/2006
• Published: 01/25/2007
• Est. Priority Date: 07/15/2005
• Status: Active Grant

• Current Assignee: Fujitsu Siemens Computers GmbH (Fujitsu Limited)
• Original Assignee: Fujitsu Siemens Computers GmbH (Fujitsu Limited)
• Inventors: Veh, Gunther
• Granted Patent: US 7,391,617 B2
• Time in Patent Office: Days
• US Class Current: 361/679.460
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling arrangement for a computer system includes a base plate, a system board which coupled to the base plate, a processor arranged on the system board, and a cooling apparatus arranged on the processor. A holding plate is provided between the base plate and the system board in the region of the processor, and the cooling apparatus is connected, via connectors, to the holding plate such that the cooling apparatus can move relative to the holding plate.

Claims

1. A cooling arrangement for a computer system, comprising:

a base plate;

a system board coupled to the base plate;

a processor arranged on the system board;

a cooling apparatus coupled to the processor; and

a holding plate disposed between the base plate and the system board in a region of the processor, wherein the cooling apparatus is coupled to the holding plate via connectors such that the cooling apparatus is moveable with respect to the holding plate.

2. The cooling arrangement of claim 1, wherein the connectors comprise spring elements that enable the cooling apparatus to tilt away from and return to a resting position thereby allowing heat to continue to be transferred from the processor to the cooling apparatus.

3. The cooling arrangement of claim 2, wherein the connectors further comprise a first bearing point that limits the tilting movement of the cooling apparatus such that damage to the processor or the system board, in response to the cooling apparatus being deflected, is prevented.

4. The cooling arrangement of claim 1, wherein the holding plate comprises threaded holes and the connectors are coupled to the holding plate via a screw connection.

5. The cooling arrangement of claim 4, wherein the connectors comprise a second bearing point that allows the connectors to be screwed into the threaded hole to the extent of the second bearing point.

6. The cooling arrangement of claim 1, wherein the cooling apparatus comprises a heat pipe.

7. The cooling arrangement of claim 1, wherein the cooling apparatus comprises a fan.

8. The cooling arrangement of claim 1, wherein the processor and the system board are designed in accordance with the Intel LGA 775 standard.

9. The cooling arrangement of claim 8, wherein the cooling apparatus is heavier than the established weight in the Intel LGA 775 standard.

10. The cooling arrangement of claim 1, further comprising at least one spacer arranged between the base plate and the system board, the at least one spacer limiting convex bending of the system board.

11. A computer system, comprising:

a housing including a base plate;

a housing fan; and

a cooling arrangement, comprising;

the base plate;

a system board coupled to the base plate;

a processor arranged on the system board;

a cooling apparatus coupled to the processor; and

a holding plate disposed between the base plate and the system board in a region of the processor, wherein the cooling apparatus is coupled to the holding plate via connectors such that the cooling apparatus is moveable with respect to the holding plate, and wherein the cooling apparatus is arranged in the housing such that the air flow of the housing fan supplies cooling air to the cooling apparatus.

12. The computer system of claim 11, further comprising a power supply having a fan that is used as a housing fan.

13. A method of cooling a processor mounted on a system board coupled to a base plate of a computer housing, the method comprising:

coupling a cooling apparatus to the processor to dissipate heat from the processor; and

moveably coupling the cooling apparatus to a holding plate disposed on an opposite side of the system board from the cooling apparatus such that the cooling apparatus tilts relative to the holding plate in response to application of an external force.