Radiator for light emitting unit, and backlight device

• US 20070019419A1
• Filed: 07/22/2005
• Published: 01/25/2007
• Est. Priority Date: 07/22/2005
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Shibata, Hirokazu, Hafuka, Tabito
• Granted Patent: US 7,431,475 B2
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: H05K 7/2099 Liquid coolant with phase change

Abstract

The present invention provides a radiator for a light emitting unit, annexed to the light emitting unit including a multiplicity of light emitting diodes mounted on substantially the same axis line on a first principal surface of a wiring substrate. The radiator includes a radiating plate and a heat pipe. The radiating plate is combined with the wiring substrate, with a first principal surface faced as a faying surface to a second principal surface opposite to the first principal surface of the wiring substrate, and is provided with a heat pipe fitting portion. The heat pipe is mounted into the heat pipe fitting portion of the radiating plate while keeping close contact with the inner wall of the heat pipe fitting portion. The heat generated from the light emitting diode group is transferred to a radiating means through the radiating plate and the heat pipe.

Claims

1. A radiator for a light emitting unit, annexed to said light emitting unit including a multiplicity of light emitting diodes mounted on substantially the same axis line on a first principal surface of a wiring substrate, said radiator comprising:

a radiating plate combined with said wiring substrate, with a first principal surface faced as a faying surface to a second principal surface opposite to said first principal surface of said wiring substrate, and provided with a heat pipe fitting portion; and

a heat pipe mounted into said heat pipe fitting portion of said radiating plate while keeping close contact with the inner wall of said heat pipe fitting portion;

wherein

the heat generated from said light emitting diode group is transferred to a radiating means through said radiating plate and said heat pipe.

2. The radiator for a light emitting unit as set forth in claim 1, wherein said heat pipe fitting portion provided in said radiating plate is composed of a recessed portion opened in a second principal surface opposite to said first principal surface constituting said faying surface in relation to said wiring substrate.

3. The radiator for a light emitting unit as set forth in claim 2, wherein

said radiating plate has a structure in which said heat pipe fitting recessed portion is formed with a depth roughly equal to the outside diameter of said heat pipe, and

said second principal surface is mounted to a back panel, whereby said heat pipe fitted in said heat pipe fitting recessed portion is pressed by said back panel into close contact with said inner wall of said heat pipe fitting recessed portion.

4. The radiator for a light emitting unit as set forth in claim 2, wherein

said radiating plate is integrally provided with caulking projected portions at opposite opening edge portions of said heat pipe fitting recessed portion, and

a caulking treatment of bending each said caulking projected portion inwards is conducted, whereby said heat pipe fitted in said heat pipe fitting recessed portion is pressed into close contact with said inner wall of said heat pipe fitting recessed portion.

5. The radiator for a light emitting unit as set forth in claim 1, wherein

said radiating means are provided in both side regions of a second principal surface, opposed to a first principal surface to which to mount said radiating unit, of said back panel, and

a circuit unit is mounted by using as a mount surface of the region, between said radiating means, of said second principal surface.

6. A backlight device to be combined with a transmission type display panel so as to supply display light to the whole area of said display panel from the back side, comprising:

a backlight unit having a wiring substrate disposed opposite to the back surface of said display panel, and a multiplicity of light emitting diodes mounted on substantially the same axis line on a first principal surface of said wiring substrate;

a radiating unit which is combined with said wiring substrate, with a first primary surface faced as a faying surface to a second principal surface opposite to said first principal surface of said wiring substrate, and which has a radiation plate provided with a heat pipe fitting portion, a heat pipe mounted in said heat pipe fitting portion of said radiating plate while keeping close contact with the inner wall of said heat pipe fitting portion, and a radiating means for receiving from said radiating plate and said heat pipe the heat generated from said light emitting diodes; and

a back panel to which said radiating plate is mounted by using a second principal surface opposite to said first principal surface as a mount surface.

7. The backlight device as set forth in claim 6, wherein

said backlight unit and said radiating unit are prepared in the form of segment bodies, and a multiplicity of said segment bodies are arranged in a column-row matrix form on the back surface of said display panel so as to constitute said backlight unit;

and

said heat pipe is fitted, in a penetrating manner, in said heat pipe fitting portions of the plurality of said segment bodies arranged adjacently in the column direction or the row direction.

8. The backlight device as set forth in claim 6, wherein each said radiating unit has a structure in which said radiating plate is provided with said heat pipe fitting portion, which is composed of a recessed portion opened in a second principal surface opposed to said first principal surface constituting a faying surface for faying with said wiring substrate.

9. The backlight device as set forth in claim 8, wherein

said heat pipe fitting recessed portion is formed in said second principal surface of said radiating plate, in a depth roughly equal to the outside diameter of said heat pipe;

and

said second principal surface of said radiating plate is mounted to said back panel, whereby said heat pipe fitted in said heat pipe fitting recessed portion is pressed by said back panel into close contact with the inner wall of said heat pipe fitting recessed portion.

10. The backlight device as set forth in claim 8, wherein

each said radiating unit is provided with said heat pipe fitting recessed portion formed by integrally providing said radiating plate with caulking projected portions faced to opening edge portions;

and

a caulking treatment of bending each said caulking projected portion inwards is conducted, whereby said heat pipe fitted in said heat pipe fitting recessed portion is pressed into close contact with the inner wall of said heat pipe fitting recessed portion.

11. The backlight device as set forth in claim 6, wherein

said radiating means are provided in both side regions of a second principal surface, opposite to a first principal surface to which said radiating unit is mounted, of said back panel;

and

a circuit unit is mounted by using the region, between said radiating means, of said second principal surface as a mount surface.