Scanning probe microscopy inspection and modification system

• US 20070022804A1
• Filed: 04/25/2006
• Published: 02/01/2007
• Est. Priority Date: 07/28/1994
• Status: Active Grant

• Current Assignee: Terraspan LLC
• Original Assignee: General Nanotechnology LLC
• Inventors: Kley, Victor
• Granted Patent: US 7,485,856 B2
• Time in Patent Office: Days
• US Class Current: 73/105
• CPC Class Codes: G01B 7/31 for testing the alignment of axes
• CPC Class Codes: G01N 23/225 using electron or ion
• CPC Class Codes: G01Q 10/02 Coarse scanning or positioning
• CPC Class Codes: G01Q 10/04 Fine scanning or positioning
• CPC Class Codes: G01Q 10/06 Circuits or algorithms therefor
• CPC Class Codes: G01Q 20/00 Monitoring the movement or position of the probe
• CPC Class Codes: G01Q 20/02 by optical means
• CPC Class Codes: G01Q 30/04 Display or data processing devices
• CPC Class Codes: G01Q 40/00 Calibration, e.g. of probes
• CPC Class Codes: G01Q 60/04 STM [Scanning Tunnelling Microscopy] combined with AFM [Atomic Force Microscopy]
• CPC Class Codes: G01Q 60/16 Probes, their manufacture, or their related instrumentation, e.g. holders
• CPC Class Codes: G01Q 60/22 Probes, their manufacture, or their related instrumentation, e.g. holders
• CPC Class Codes: G01Q 60/38 Probes, their manufacture, or their related instrumentation, e.g. holders
• CPC Class Codes: G01Q 60/58 SThM [Scanning Thermal Microscopy] or apparatus therefor, e.g. SThM probes
• CPC Class Codes: G01Q 70/02 Probe holders
• CPC Class Codes: G01Q 70/06 Probe tip arrays
• CPC Class Codes: G01Q 80/00 Applications, other than SPM, of scanning-probe techniques manufacture or treatment of nanostructures B82B3/00; recording or reproducing information using near-field interaction G11B9/12, G11B11/24, G11B13/08
• CPC Class Codes: G02B 21/002 Scanning microscopes scanning near field optical microscopes G01Q60/18
• CPC Class Codes: G03F 1/72 Repair or correction of mask defects
• CPC Class Codes: G03F 1/84 Inspecting
• CPC Class Codes: G03F 7/2049 : using a cantilever
• CPC Class Codes: G03F 7/704 : Scanned exposure beam, e.g. raster-, rotary- and vector scanning mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358
• CPC Class Codes: G03F 7/70616 : Monitoring the printed patterns
• CPC Class Codes: G11B 11/12 : using recording by optical means G11B11/03 takes precedence G11B11/10 takes precedence
• CPC Class Codes: G11B 11/16 : using recording by mechanical cutting, deforming or pressing G11B11/002 takes precedence
• CPC Class Codes: G11B 2005/0002 : Special dispositions or recording techniques
• CPC Class Codes: G11B 2005/0021 : Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
• CPC Class Codes: G11B 5/232 : Manufacture of gap
• CPC Class Codes: G11B 5/3116 : Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks G11B5/3113, G11B5/245 take precedence
• CPC Class Codes: G11B 5/3163 : Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
• CPC Class Codes: G11B 5/3166 : Testing or indicating in relation thereto, e.g. before the fabrication is completed
• CPC Class Codes: G11B 9/14 : using microscopic probe means , i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information marking using electrical current B41M5/20; measuring roughness or irregularity of surfaces G01B7/34; details of scanning-probe microscopes G01Q
• CPC Class Codes: G11B 9/1409 : Heads
• CPC Class Codes: G11B 9/1418 : Disposition or mounting of heads or record carriers G11B17/00 and G11B19/00 take precedence
• CPC Class Codes: G11B 9/1427 : with provision for moving the heads or record carriers relatively to each other or for access to indexed parts without effectively imparting a relative movement
• CPC Class Codes: G11B 9/1436 : with provision for moving the heads or record carriers relatively to each other
• CPC Class Codes: G11B 9/1445 : switching at least one head in operating function; Controlling the relative spacing to keep the head operative, e.g. for allowing a tunnel current flow
• CPC Class Codes: G11B 9/1454 : Positioning the head or record carrier into or out of operative position or across information tracks; Alignment of the head relative to the surface of the record carrier G11B9/1445 takes precedence
• CPC Class Codes: G11B 9/149 : characterised by the memorising material or structure
• CPC Class Codes: H02N 1/006 : of the gap-closing type H02N1/004 takes precedence
• CPC Class Codes: Y10S 977/855 : for manufacture of nanostructure
• CPC Class Codes: Y10S 977/871 : with environmental regulation means

Abstract

A scanning probe microscopy (SPM) inspection and/or modification system which uses SPM technology and techniques. The system includes various types of microstructured SPM probes for inspection and/or modification of the object. The components of the SPM system include microstructured calibration structures. A probe may be defective because of wear or because of fabrication errors. Various types of reference measurements of the calibration structure are made with the probe or vice versa to calibrate it. The components of the SPM system further include one or more tip machining structures. At these structures, material of the tips of the SPM probes may be machined by abrasively lapping and chemically lapping the material of the tip with the tip machining structures.

Claims

1-8. -8. (canceled)

9. A graphical user interface for rendering first measurement data and second measurement data on a display, the first and second measurement data each comprising measurement data points that each include first and second coordinate values representing a position in a plane, each of the data points of the first measurement data further including a measurement value representing a measurement of a first predefined measurement parameter, each of the data points of the second measurement data further including a measurement value representing a measurement of a second predefined measurement parameter, the graphical user interface comprising:

a surface image generator to generate first image data from the first measurement data and second image data from the second measurement data, the first image data representing a 3-D first surface image of a first surface that extends along the plane and is contoured based on the measurement values of the data points of the first measurement data, the second image data representing a 3-D second surface image of a second surface that extends along the plane and is contoured based on the measurement values of the data points of the second measurement data; and

an overlay image generator to generate overlay image data by overlaying the first and second image data, the overlay image data representing a 3-D overlay image of one of the first and second surfaces overlaid on the other one of the first and second surfaces, the overlay image being displayed by the display in response to the overlay image data.

10-17. -17. (canceled)

18. A graphical user interface for rendering first measurement data and second measurement data on a display, the first and second measurement data each comprising measurement data points that each include first and second coordinate values representing a position in a plane, each of the data points of the first measurement data further including a measurement value representing a measurement of a first predefined measurement parameter, each of the data points of the second measurement data further including a measurement value representing a measurement of a second predefined measurement parameter, the graphical user interface comprising:

a surface image generator to generate base image data from the first measurement data, the base image data representing a 3-D surface image of a surface that extends along the plane and is contoured based on the measurement values of the data points of the first measurement data,

an augmentation data generator to generate augmentation data from the second measurement data, the augmentation data providing an augmentation of the surface based on the measurement values of the data points of the second measurement data;

an augmented image generator to generate augmented image data by augmenting the base image data with the augmentation data, the augmented image data representing a 3-D augmented image of the surface augmented by the augmentation.

19-43. -43. (canceled)

44. An SPM probe that comprises:

an SPM tool that has a cantilever and a tip on the cantilever; and

a base that has an upper and lower surface and surrounds the SPM tool;

the cantilever of the SPM tool being connected to the base so that the SPM tool is located between the upper and lower surface when the cantilever is not bending, the cantilever of the SPM tool being capable of being selectively bent back and forth by a tip activation apparatus so as to selectively position the tip of the SPM tool below and above the lower surface of the base whereby the tip of the SPM tool may be selectively activated and deactivated for making SPM measurements or SPM modifications to an object and protected from being damaged when deactivated.

45. An SPM probe as recited in claim 44 that further comprises the tip activation apparatus.

46. An SPM probe as recited in claim 45 wherein:

the cantilever is conductive;

the tip activation apparatus comprises electrodes fixed to the base above and below the cantilever;

whereby the cantilever is selectively bent back and forth by applying selected voltages to the electrodes and the cantilever.

47. An SPM probe as recited in claim 44 further comprising:

an additional SPM tool having a cantilever and a tip on the cantilever; and

the cantilever of the additional SPM tool being connected to the base so that the additional SPM tool is located between the upper and lower surface when the cantilever is not bending, the cantilever of the additional SPM tool being capable of being selectively bent down and up by a tip activation apparatus so as to selectively position the tip of the additional SPM tool below and above the lower surface of the base whereby the tip of the additional SPM tool may be selectively activated and deactivated for making SPM measurements of or SPM modifications to an object and protected from being damaged when deactivated.

48-53. -53. (canceled)

54. A microstructured force balance that comprises:

a base;

a contact platform;

a suspension system connected to the base and the contact platform to displaceably suspend the contact platform over the base, the contact platform being displaced by varying amounts of displacement when varying amounts of force are applied to the contact platform by contacting the contact platform; and

a displacement actuator to selectively apply varying amounts of force to the contact platform to selectively cause varying amounts of displacement of the contact platform with respect to the base.

57. A microstructured force balance as recited in claim 54 wherein:

the suspension system displaceably suspends the contact platform over the base in multiple directions;

the contact platform being displaced in the multiple directions by the varying amounts of displacement when the varying amounts of force are applied to the contact platform in the multiple directions by contacting the contact platform; and

the microstructured force balance further comprises multiple ones of the displacement actuator to selectively apply the varying amounts of force in the multiple directions to selectively cause the varying amounts of displacement of the contact platform in the multiple directions.

58. A microstructured force balance as recited in claim 54 that further comprises one or more displacement sensors to sense the varying amounts of displacement of the contact platform.

59. A microstructured force balance as recited in claim 58 wherein:

the suspension system displaceably suspends the contact platform over the base in multiple directions;

the contact platform being displaced by the varying amounts of displacement in the multiple directions when the varying amounts of force are applied to the contact platform in the multiple directions by contacting the contact platform;

the microstructured force balance further comprises multiple ones of the displacement actuator to selectively apply the varying amounts of force in the multiple directions to selectively cause the varying amounts of displacement of the contact platform in the multiple directions; and

the microstructured force balance further comprises multiple ones of the displacement sensor to sense the varying amounts of displacement of the contact platform in the multiple directions.

60. A microstructured force balance as recited in claim 58 that further comprises a control circuit located on the base, the control circuit being coupled to the displacement actuator to control the displacement actuator to selectively apply the varying amounts of force to the contact platform in response to displacement control signals, the control circuit being coupled to the displacement sensor to generate displacement measurement signals that provide a measure of the varying amounts of displacement of the contact platform sensed by the displacement sensor.

61. A microstructured force balance as recited in claim 54 wherein:

the contact platform comprises a displaceable electrode that is displaced when the contact platform is displaced; and

the displacement actuator comprises the displaceable electrode and a stationary electrode fixedly coupled to the base such that the varying amounts of force selectively applied to the contact platform by the displacement actuator are applied by selectively applying voltages across the stationary and displaceable electrodes.

62. A microstructured force balance as recited in claim 58 wherein:

the contact platform comprises a displaceable electrode that is displaced when the contact platform is displaced; and

the displacement sensor comprises the displaceable electrode and a stationary electrode fixedly coupled to the base such that the varying amounts of displacement of the contact platform are sensed by sensing voltage changes across the stationary and displaceable electrodes.

63. A microstructured force balance as recited in claim 54 wherein:

the contact platform comprises a displaceable comb structure that is displaced when the contact platform is displaced;

the displacement actuator comprises the displaceable comb structure and a stationary comb structure fixedly coupled to the base such that the varying amounts of force selectively applied to the contact platform by the displacement actuator are applied by selectively applying voltages across the stationary and displaceable comb structures.

64. A microstructured force balance as recited in claim 58 wherein:

the contact platform comprises a displaceable comb structure that is displaced when the contact platform is displaced; and

the displacement sensor comprises the displaceable comb structure and a stationary comb structure fixedly coupled to the base such that the varying amounts of displacement of the contact platform are sensed by sensing voltage changes across the stationary and displaceable comb structures.

65-90. -90. (canceled)

91. A method of performing repairs on a mask, the method comprising:

receiving modification data representing a required modification to be made to the mask'"'"'s material; and

in response to the modification data, directing an ion beam to the mask with an SPM probe configured as an ion beam tool.

92. A method as recited in claim 91 further comprising generating the modification data by making SPM measurements of the mask.

93. A method as recited in claim 91 wherein the ion beam is used to chemically modify the mask'"'"'s material.

97. A method as recited in claim 91 further comprising generating the modification data by making SPM measurements of the object.

98. A method as recited in claim 91 wherein the ion beam is used to chemically modify the object'"'"'s material.

94. A method of performing repairs on a mask, the method comprising:

receiving modification data representing a required modification to be made to the mask'"'"'s material; and

in response to the modification data, directing an electron beam to the mask with an SPM probe configured as an electron beam tool.

95. A method as recited in claim 94 wherein the electron beam is used to chemically modify the mask'"'"'s material.

96. A method of changing an object, the method comprising:

receiving modification data representing a required modification to be made to the object'"'"'s material; and

in response to the modification data, directing an ion beam to the object with an SPM probe configured as an ion beam tool.

99. A method of changing an object, the method comprising:

receiving modification data representing a required modification to be made to the object'"'"'s material; and

in response to the modification data, directing an electron beam to the object with an SPM probe configured as an electron beam tool.

100. A method as recited in claim 99 further comprising generating the modification data by making SPM particle beam measurements of the object.

101. A method as recited in claim 99 wherein the electron beam is used to chemically modify the object'"'"'s material.

102. An SPM probe in which a means is provided to emit an electron through a fluid to an object such that the mean free path of the electron in the fluid is greater then the distance through the fluid.

103. An SPM probe in which a means is provided to emit an ion through a fluid to an object such that the mean free path of the ion in the fluid is greater then the distance through the fluid.