Thermocompression bonding module and method of using the same

• US 20070023478A1
• Filed: 08/01/2005
• Published: 02/01/2007
• Est. Priority Date: 08/01/2005
• Status: Abandoned Application

• Current Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Inventors: Levannier, Vincent, Borisuk, Peter, Steckler, John, Ethen, Edward
• Application Number:
  US11/194,389
• Publication Number:
  US 20070023478A1
• Time in Patent Office: Days
• US Class Current: 228/1.100
• CPC Class Codes: B23K 20/023 Thermo-compression bonding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape

Abstract

A thermocompression bonding module includes a thermode assembly configured to be mounted to a plate member. The thermode assembly includes a heater assembly configured to apply a bonding force to an item during a bonding operation and a control device coupled to the heater assembly for adjusting the bonding force applied by the heater assembly to the item. A force feedback device is positioned, relative to the heater assembly in order to detect the bonding force applied by the heater assembly. The control device adjusts the bonding force based on the bonding force detected by the force feedback device.

Claims

1. A thermocompression bonding module, comprising:

a thermode assembly configured to be mounted to a plate member, said thermode assembly comprising a heater assembly, configured to apply a bonding force to an item during a bonding operation, and a control device coupled to said heater assembly for adjusting the bonding force applied by said heater assembly to the item; and

a force feedback device positioned relative to said heater assembly in order to detect the bonding force applied by said heater assembly, said control device adjusting the bonding force based on the bonding force detected by said force feedback device.

2. The thermocompression bonding module of claim 1, wherein said control device is configured to adjust a position of said heater assembly with respect to the plate member.

3. The thermocompression bonding module of claim 1, wherein said control device comprises a servo motor for controlling a linear position of said heater assembly with respect to the plate member along a longitudinal axis extending perpendicular to a conveyance direction along which the item is moved.

4. The thermocompression bonding module of claim 1, wherein said heater assembly is movable in an axial direction by said control device, said force feedback device is substantially aligned with said heater assembly such that said force feedback device detects the bonding force applied in the direction of movement of said heater assembly.

5. The thermocompression bonding module of claim 1, wherein said heater assembly comprises a heating element and an insulator surrounding said heating element, said heating element is exposed through a portion of said insulator such that said heating element is configured to engage the item.

6. The thermocompression bonding module of claim 1, further comprising a second heater assembly substantially aligned with said heater assembly in a direction of the bonding force such that the item extends between said heater assembly and said second heater assembly.

7. The thermocompression bonding module of claim 1, wherein said force feedback device comprises a load cell.

8. A thermocompression bonding apparatus, comprising:

a plate member;

a base separated from said plate member by a gap, the gap configured to receive an item to be bonded;

a thermode assembly configured to be mounted to said plate member, said thermode assembly comprising a heater assembly, configured to apply a bonding force to the item during a bonding operation, and a control device coupled to said heater assembly for adjusting the bonding force applied by said heater assembly to the item; and

a force feedback device positioned relative to said heater assembly in order to detect the bonding force applied by said heater assembly, said control device adjusting the bonding force based on the bonding force detected by said force feedback device.

9. The thermocompression bonding apparatus of claim 8, wherein said control device is configured to adjust a position of said heater assembly with respect to said plate member.

10. The thermocompression bonding apparatus of claim 8, wherein said control device comprises a servo motor for controlling a linear position of said heater assembly with respect to the plate member along a longitudinal axis extending perpendicular to a conveyance direction along which the item is moved.

11. The thermocompression bonding apparatus of claim 8, wherein said heater assembly is movable in an axial direction by said control device, said force feedback device is substantially aligned with said heater assembly such that said force feedback device detects the bonding force applied in the direction of movement of said heater assembly.

12. The thermocompression bonding apparatus of claim 8, wherein said thermode assembly and said force feedback device are modular and configured to be removably mounted to said plate member and said base.

13. The thermocompression bonding apparatus of claim 8, further comprising a second heater assembly configured to be mounted to said base such that said second heater assembly is substantially aligned with said heater assembly in a direction of the bonding force such that the item extends between said heater assembly and said second heater assembly.

14. The thermocompression bonding apparatus of claim 8, wherein said force feed device is mounted to the base and is substantially aligned with the heater assembly.

15. The thermocompression bonding apparatus of claim 8, wherein a temperature of said heater assembly is adjustable during the application of the bonding force.

16. A method for thermocompression bonding, the method comprising:

conveying a series of items along a conveyance direction to a thermocompression bonding station;

at the bonding station, applying heat and a bonding force to an item by compressing the item with a heater assembly;

detecting the bonding force applied at the bonding station to the item; and

adjusting the bonding force applied at the bonding station by the heater assembly based on the bonding force detected during compression of the item.

17. The method of claim 16, further comprising providing a base and plate member at the bonding station, the base and plate member being separated by a gap, wherein the conveying a series of items comprises conveying a series of items through the gap.

18. The method of claim 16, wherein the heater assembly is mounted to a plate member, wherein the adjusting includes adjusting a position of the heater assembly with respect to the plate member.

19. The method of claim 16, further comprising providing a plate member having an aperture extending therethrough, wherein the heater assembly is positioned within the aperture.

20. The method of claim 16, further comprising providing a force feedback device, wherein the detecting includes detecting the bonding force using the force feedback device.