×

Thermocompression bonding module and method of using the same

  • US 20070023478A1
  • Filed: 08/01/2005
  • Published: 02/01/2007
  • Est. Priority Date: 08/01/2005
  • Status: Abandoned Application
First Claim
Patent Images

1. A thermocompression bonding module, comprising:

  • a thermode assembly configured to be mounted to a plate member, said thermode assembly comprising a heater assembly, configured to apply a bonding force to an item during a bonding operation, and a control device coupled to said heater assembly for adjusting the bonding force applied by said heater assembly to the item; and

    a force feedback device positioned relative to said heater assembly in order to detect the bonding force applied by said heater assembly, said control device adjusting the bonding force based on the bonding force detected by said force feedback device.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×