Acicular ITO for LED array

• US 20070023765A1
• Filed: 07/29/2005
• Published: 02/01/2007
• Est. Priority Date: 07/29/2005
• Status: Abandoned Application

• Current Assignee: World Properties Incorporated
• Original Assignee: World Properties Incorporated
• Inventors: Budinavicius, Ilona, Thomas, Alan, Paciorek, Walter
• Application Number:
  US11/193,305
• Publication Number:
  US 20070023765A1
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

In an array of LEDs coupled between a transparent substrate and an electrode, a light emitting surface of each LED is in electrical contact with a region of acicular ITO. By contacting the light emitting surface of the die, the acicular ITO also provides light scattering. The contact regions are interconnected to form the array. The acicular ITO acts as a ballast resistance for each die and the resistance can be trimmed for more uniform current among the LEDs. Because each LED is individually ballasted, the LEDs in an array can be driven in any pattern or all simultaneously at a consistent brightness.

Claims

1. In an array of LEDs coupled between a transparent substrate and an electrode, the improvement comprising:

a region of acicular ITO between at least one LED and the transparent substrate for electrically coupling to the light emitting surface of the LED.

2. The array as set forth in claim 1 wherein each LED in the array is coupled to the substrate by a region of acicular ITO, thereby individually ballasting each LED in the array.

3. The array as set forth in claim 2 wherein the regions of acicular ITO are electrically coupled together to provide simultaneous light emission from all LEDs in the array.

4. The array as set forth in claim 3 wherein groups of LEDs are coupled in parallel in rows and the rows are coupled in series.

5. The array as set forth in claim 2 wherein at least two regions are coupled to a bus bar by a section of acicular ITO.

6. The array as set forth in claim 5 wherein the area of a first section is not equal to the area of a second section.

7. A light emitting device comprising:

a semiconductive die having a junction that emits light through a surface of the die when the junction is forward biased;

a layer of acicular ITO on said surface.

8. A method for making an array of light emitting diodes, said method comprising the steps of:

forming a plurality of conductive areas on a substrate, wherein each conductive area is acicular ITO;

attaching an LED on each conductive area; and

positioning each LED in such a way that a light emitting surface of the LED is in contact with the acicular ITO.

9. The method as set forth in claim 8 and further including the steps of:

forming a bus bar on the substrate; and

forming the conductive areas partially overlapping the bus bar.

10. In an array of LEDs, each including a p-n junction and a conductor for supplying current to at least one p-n junction, the improvement comprising:

a region of acicular ITO between one side of at least one p-n junction and said conductor for electrically coupling the p-n junction to the conductor.

11. The array set forth in claim 10 wherein the region provides a ballasting load for said p-n junction.

12. The array as set forth in claim 11 wherein the area of said region can be adjusted to vary the load for said p-n junction.