Semiconductor device having capacitors for reducing power source noise
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Abstract
A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.
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Citations
16 Claims
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1-15. -15. (canceled)
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16. A semiconductor device comprising:
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a substrate having one principal plane furnished with solder balls;
a semiconductor chip mounted on another principal plane of the substrate, the semiconductor chip being electrically connected to the substrate by metal wires;
chip capacitors mounted on the semiconductor chip; and
a shield plane connected to ground potential and incorporated in the substrate.
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Specification