Dual BGA alloy structure for improved board-level reliability performance
First Claim
1. A method of manufacturing a ball grid array package, comprising:
- combining a die having a first area with a substrate to form a package having a second, larger area, whereby one side of the package has an area overlying the die, and a surrounding area overlying the substrate but not the die; and
forming a ball grid array of solder balls over the one side, wherein a first set of the solder balls overlies the die near its perimeter and a second set of solder balls proximate the perimeter of the package does not overly the die;
wherein the first set of solder balls has a first composition and the second set of solder balls has a second, distinctly different, composition.
1 Assignment
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Accused Products
Abstract
A method of improving the performance of a ball grid array package under temperature cycling and drop tests is disclosed. The method comprises forming a ball grid array with two types of solder balls. The first type of ball has a composition that improves performance under temperature cycling and the second set of solder balls has a composition that improves performance under drop testing. Preferably, the first set of balls is under the die near its perimeter and the second set of balls is located near the package perimeter, particularly at corners. A related concept pertains to a semiconductor device comprising a printed circuit board and a ball grid array package attached to the printed circuit board by an array of solder balls. The solder ball array comprises first and second sets of solder balls, the two sets having distinctly different compositions.
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Citations
20 Claims
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1. A method of manufacturing a ball grid array package, comprising:
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combining a die having a first area with a substrate to form a package having a second, larger area, whereby one side of the package has an area overlying the die, and a surrounding area overlying the substrate but not the die; and
forming a ball grid array of solder balls over the one side, wherein a first set of the solder balls overlies the die near its perimeter and a second set of solder balls proximate the perimeter of the package does not overly the die;
wherein the first set of solder balls has a first composition and the second set of solder balls has a second, distinctly different, composition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device, comprising:
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a printed circuit board;
a ball grid array package attached to the printed circuit board by an array of solder balls;
wherein the array comprises a first set of solder balls and a second set of solder balls, the two sets of solder balls having distinctly different compositions. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of improving the performance of a ball grid array package under temperature cycling and drop tests, comprising:
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forming a first portion of a connection array for the ball grid array package using a first solder ball type; and
forming a second portion of the connection array using a second solder ball type;
wherein the first set of solder balls improves performance under drop testing and the second set of solder balls improves performance under temperature cycle testing, and the locations for the first and second solder ball types are selected to improve the overall ability of the ball grid array package to pass both temperature cycle and drop testing.
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Specification