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Dual BGA alloy structure for improved board-level reliability performance

  • US 20070023910A1
  • Filed: 07/29/2005
  • Published: 02/01/2007
  • Est. Priority Date: 07/29/2005
  • Status: Abandoned Application
First Claim
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1. A method of manufacturing a ball grid array package, comprising:

  • combining a die having a first area with a substrate to form a package having a second, larger area, whereby one side of the package has an area overlying the die, and a surrounding area overlying the substrate but not the die; and

    forming a ball grid array of solder balls over the one side, wherein a first set of the solder balls overlies the die near its perimeter and a second set of solder balls proximate the perimeter of the package does not overly the die;

    wherein the first set of solder balls has a first composition and the second set of solder balls has a second, distinctly different, composition.

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