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SEMICONDUCTOR DEVICE

  • US 20070024409A1
  • Filed: 06/29/2006
  • Published: 02/01/2007
  • Est. Priority Date: 07/27/2005
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a package having a cavity in the interior thereof, a chip having a semiconductor element;

    a board comprised of the chip fixed to a first region on the upper face thereof; and

    an adhesive portion formed in a second region on the bottom face of the board, the adhesive portion fixing the board to a first face of the cavity, and the second region being a region on the bottom face of the board other than the region thereof underneath the first region.

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