SEMICONDUCTOR DEVICE

• US 20070024409A1
• Filed: 06/29/2006
• Published: 02/01/2007
• Est. Priority Date: 07/27/2005
• Status: Active Grant

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: TAKEMASA, Kengo
• Granted Patent: US 7,615,835 B2
• Time in Patent Office: Days
• US Class Current: 338/4
• CPC Class Codes: G01P 1/006 used for thermal compensation
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors

Abstract

A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof, and an adhesive portion formed in a second region on the bottom face of the board in order to fix the board to a first face of the cavity, the second region being a region on the board other than the region thereof underneath the first region.

Claims

1. A semiconductor device comprising:

a package having a cavity in the interior thereof,

a chip having a semiconductor element;

a board comprised of the chip fixed to a first region on the upper face thereof; and

an adhesive portion formed in a second region on the bottom face of the board, the adhesive portion fixing the board to a first face of the cavity, and the second region being a region on the bottom face of the board other than the region thereof underneath the first region.

2. The semiconductor device according to claim 1, wherein

the package comprises a concave portion formed in the first face under the chip.

3. The semiconductor device according to claim 2, wherein

the package comprises a convex portion on the bottom face of the concave portion.

4. The semiconductor device according to claim 1, wherein

the first region is separated from the second region in a horizontal direction.

5. The semiconductor device according to claim 1, wherein

the adhesive portion is formed along the exterior edge of the bottom face of the board.

6. The semiconductor device according to claim 3, wherein

the upper face of the convex portion has approximately the same height as the first face.

7. The semiconductor device according to claim 1, wherein

the adhesive portion is comprised of a solidified resin.

8. The semiconductor device according to claim 1, wherein

the adhesive portion is comprised of a silicone resin or fluorine resin.

9. The semiconductor device according to claim 1, wherein

the board is comprised of a silicon material.

10. The semiconductor device according to claim 1, further comprising:

a first electrode pad formed on the chip;

a wiring pattern formed in the package, at least a portion of the wiring pattern being exposed inside the cavity;

a second electrode pad formed on the bottom face of the package and connected to the wiring pattern; and

a metal wire electrically connecting the first electrode pad and the exposed wiring pattern.

11. The semiconductor device according to claim 1, wherein

at least a portion of the package is comprised of a ceramic material.

12. The semiconductor device according to claim 1, wherein

the semiconductor element comprises an acceleration sensor.

13. The semiconductor device according to claim 1, wherein

the semiconductor element comprises an acceleration sensor having a fixing portion, a spindle body, and one or more beams, the fixing portion being fixed to the board, the beams suspending the spindle body from the fixing portion, and the spindle body being movable with respect to the fixing portion.