Scalable subsystem architecture having integrated cooling channels
First Claim
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1. A scalable electronic subsystem comprising:
- a stackable module;
cooling channels provided between selected ones of said modules; and
, coolant flowing in each of said channels.
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Abstract
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections.
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Citations
20 Claims
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1. A scalable electronic subsystem comprising:
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a stackable module;
cooling channels provided between selected ones of said modules; and
,coolant flowing in each of said channels. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for building a scalable electronic system or subsystem comprising the steps of:
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a) fabricating a stackable module;
b) stacking a plurality of said modules to form said system or subsystem with a cooling channel provided between each pair of modules; and
,c) circulating a coolant in said cooling channel. - View Dependent Claims (15, 16, 17)
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18. A re-workable and well-cooled electronic subsystem comprising:
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integrated circuit chips attached to stackable modules using re-workable flip chip connectors;
spacers providing electrical feed throughs and a sealed cooling channel between each of said stackable modules;
coolant flowing in said cooling channels; and
,solder connections between said modules and said spacers in said stack that are accessible to directed jets of hot inert gas for melting said solder in selected ones of said connections for performing said rework of said subsystem. - View Dependent Claims (19, 20)
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Specification