Method and system for attachment of light emitting diodes to circuitry for use in lighting
First Claim
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1. An LED array comprising:
- a plurality of packaged LEDs each having a first terminal and a second terminal and a heat sink slug dispose between said first terminal and second terminal; and
a multiple-LED base socket having an outer surface and a pair of electrically conductive channels formed in the outer surface;
said pair of electrically conductive channels being adapted to receive the terminals of the plurality of packaged LEDs; and
said plurality of packaged LEDs being arranged adjacent one another on the outer surface of the base socket with the first terminals of the LEDs being inserted in one of the channels of said pair of electrically conductive channels and the second terminals of the LEDs being inserted in another of the channels of said pair of electrically conductive channels, wherein said heat sink slug establishes thermal contact to the outer surface of the base socket between said pair of electrically conductive channels.
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Abstract
A method and system for attaching LEDs to circuitry which would protect the LEDs from heat damage and allows for individual LEDs to be removed.
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Citations
21 Claims
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1. An LED array comprising:
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a plurality of packaged LEDs each having a first terminal and a second terminal and a heat sink slug dispose between said first terminal and second terminal; and
a multiple-LED base socket having an outer surface and a pair of electrically conductive channels formed in the outer surface;
said pair of electrically conductive channels being adapted to receive the terminals of the plurality of packaged LEDs; and
said plurality of packaged LEDs being arranged adjacent one another on the outer surface of the base socket with the first terminals of the LEDs being inserted in one of the channels of said pair of electrically conductive channels and the second terminals of the LEDs being inserted in another of the channels of said pair of electrically conductive channels, wherein said heat sink slug establishes thermal contact to the outer surface of the base socket between said pair of electrically conductive channels. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A packaged LED comprising a heat sink slug dispose between a first and second terminals having respective spring leads adapted for insertion into respective first and second conductive channels of a base socket, each of said spring leads engaging a conductive sidewall surface of said respective channels to thereby establish electrical contact between the terminals and the base socket and said heat sink slug establishing thermal contact with said base socket between said first and second conductive channels of said base socket.
- 15. A multiple-LED base socket for an LED array, the base socket having an outer surface and a pair of electrically conductive channels formed in the outer surface, and a thermal contact surface disposed between said pair of electrically conductive channels, with first and second electrically conductive channels of said pair of electrically conductive channels being adapted to receive respective first and second terminals of each of a plurality of packaged LEDs, and said thermal contact surface adapted to established thermal communication with a heat sink slug of each of the plurality of packaged LEDs.
Specification