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Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

  • US 20070026567A1
  • Filed: 06/01/2006
  • Published: 02/01/2007
  • Est. Priority Date: 06/01/2005
  • Status: Active Grant
First Claim
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1. A semiconductor module comprising components for microwave engineering in a plastic casing, wherein said semiconductor module comprises a principal surface comprising an upper side of a plastic package molding compound and at least one active upper side of a semiconductor chip, and wherein disposed on said principal surface is a multilayered conductor track structure which alternately comprises structured insulation layers and structured metal layers, wherein at least one of said insulation layers and/or said plastic package molding compound comprises at least one microwave insulation region.

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