Roll-to-roll fabricated encapsulated semiconductor circuit devices

• US 20070026571A1
• Filed: 10/03/2006
• Published: 02/01/2007
• Est. Priority Date: 03/29/2004
• Status: Active Grant

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Daniels, John, Nelson, Gregory
• Granted Patent: US 7,863,760 B2
• Time in Patent Office: Days
• US Class Current: 438/108
• CPC Class Codes: B32B 17/10036 comprising two outer glass sheets
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: B32B 17/10321 Laminated safety glass or glazing containing liquid layers
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor. The encapsulated semiconductor device includes an adhesive having the pattern of semiconductor elements fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination, the adhesive being activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the second substrate and so that the other of the first conductor and the second conductor of each semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface.

Claims

1. An encapsulated semiconductor device, comprising:

a first substrate having an electrically conductive surface;

a second substrate having an electrically conductive pattern disposed thereon;

a pattern of semiconductor elements, each of said semiconductor elements having a first conductor and a second conductor;

an adhesive having said pattern of semiconductor elements fixed thereto and disposed between said electrically conductive surface and said electrically conductive pattern to form a lamination, said adhesive being activatable to bind said second substrate to said first substrate so that one of said first conductor and said second conductor of at least one of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive pattern of said second substrate and so that the other of said first conductor and said second conductor of each of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive surface of said first substrate.

2. The encapsulated semiconductor device of claim 1, said semiconductor elements further comprising:

a third conductor disposed between said first and second conductors; and

wherein said adhesive comprises at least one electrically conductive portion for making an electrical connection with said third conductor.

3. The encapsulated semiconductor device of claim 1;

wherein said first substrate, said second substrate and said adhesive are comprised of sheet material brought together from respective rolls in a continuous roll fabrication process.

4. The encapsulated semiconductor device of claim 1;

wherein said adhesive comprises a hotmelt material activatable by applying heat and pressure to said first and second substrates to soften said hotmelt material.

5. The encapsulated semiconductor device of claim 1;

wherein said adhesive comprises a sheet; and

wherein before forming the lamination, said pattern of semiconductor elements is embedded into said sheet.

6. The encapsulated semiconductor device of claim 5, further comprising;

a transfer member; and

wherein said pattern of said semiconductor elements is formed by electrostatically attracting a plurality of said semiconductor elements on said transfer member and transferring said pattern of said semiconductor elements onto said adhesive.

7. The encapsulated semiconductor device of claim 5 further comprising;

a transfer member; and

wherein said pattern of said semiconductor elements is formed by magnetically attracting a plurality of said semiconductor elements on said transfer member and transferring said pattern of said semiconductor elements onto said adhesive.

8. The encapsulated semiconductor device of claim 5;

wherein said pattern of said semiconductor elements is formable by a pick and place device.

9. The encapsulated semiconductor device of claim 5;

wherein the pattern of semiconductor elements is formed by transferring said semiconductor elements from a lower tack adhesive to a relatively higher tack adhesive.