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INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR

  • US 20070029629A1
  • Filed: 07/20/2006
  • Published: 02/08/2007
  • Est. Priority Date: 07/21/2005
  • Status: Active Grant
First Claim
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1. A micromachined sensor having a capacitive sensing structure comprising:

  • a member comprising first and second conductive layers and a buried insulator layer separating the first and second conductive layers;

    a first set of elements defined with the first conductive layer, the first set of elements comprising at least first and second elements that are electrically isolated from each other on the member by the buried insulator layer; and

    a second set of elements capacitively coupled with the first set of elements with gaps therebetween, the capacitive couples generating capacitive outputs that vary with changes in the gaps.

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