INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR
First Claim
1. A micromachined sensor having a capacitive sensing structure comprising:
- a member comprising first and second conductive layers and a buried insulator layer separating the first and second conductive layers;
a first set of elements defined with the first conductive layer, the first set of elements comprising at least first and second elements that are electrically isolated from each other on the member by the buried insulator layer; and
a second set of elements capacitively coupled with the first set of elements with gaps therebetween, the capacitive couples generating capacitive outputs that vary with changes in the gaps.
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Accused Products
Abstract
A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to define circuitry on a surface thereof, bonding the first and second wafers together, and then etching the first wafer to complete the sensing structure, including the release of a member relative to the second wafer. The first wafer is preferably a silicon-on-insulator (SOI) wafer, and the sensing structure preferably includes a member containing conductive and insulator layers of the SOI wafer. Sets of capacitively coupled elements are preferably formed from a first of the conductive layers to define a symmetric capacitive full-bridge structure.
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Citations
42 Claims
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1. A micromachined sensor having a capacitive sensing structure comprising:
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a member comprising first and second conductive layers and a buried insulator layer separating the first and second conductive layers;
a first set of elements defined with the first conductive layer, the first set of elements comprising at least first and second elements that are electrically isolated from each other on the member by the buried insulator layer; and
a second set of elements capacitively coupled with the first set of elements with gaps therebetween, the capacitive couples generating capacitive outputs that vary with changes in the gaps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A micromachined sensor comprising a substrate, a capacitive sensing structure supported on the substrate, and interface circuitry electrically coupled to the sensing structure, the sensing structure comprising means for generating capacitive outputs that vary in response to relative movement of the sensing structure to the substrate, the interface circuitry comprising:
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means for performing multiple correlated double sampling of input thereto and output thereof; and
means for performing chopper stabilization that reduces dc and low-frequency noise and drift. - View Dependent Claims (22, 23, 24)
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25. A process of forming a micromachined sensor comprising a sensing structure and circuitry electrically coupled to the sensing structure, the process comprising:
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processing a first wafer to incompletely define the sensing structure in a first surface thereof;
processing a second wafer to define the circuitry on a surface thereof;
bonding the first and second wafers together; and
thenetching the first wafer to complete the sensing structure by removing portions of the first wafer at a second surface thereof opposite the first surface to define a member and by removing portions of the first wafer at the first surface thereof to release the member relative to the second wafer. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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Specification