MEMS RF switch module including a vertical via

• US 20070029659A1
• Filed: 10/11/2006
• Published: 02/08/2007
• Est. Priority Date: 06/25/2003
• Status: Active Grant

• Current Assignee: John Heck, Joseph Hayden, Tsung-Kuan Chou
• Original Assignee: John Heck, Joseph Hayden, Tsung-Kuan Chou
• Inventors: Heck, John, Chou, Tsung-Kuan, Hayden, Joseph
• Granted Patent: US 7,324,350 B2
• Time in Patent Office: Days
• US Class Current: 257/684
• CPC Class Codes: B81B 2201/018 Switches not provided for in B81B2201/014 - B81B2201/016
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 1/5805 Connections to printed circuits for slide switches H01H15/005; for tumbler switches H01H23/006
• CPC Class Codes: H01L 2224/16 of an individual bump connector

Abstract

An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.

Claims

1. A system, comprising:

a printed circuit board (PCB);

a Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module coupled to the PCB, the MEMS RF switch module comprising;

an RF switch array; and

at least one vertical via to electrically couple the RF switch array to the PCB; and

an amplifier electrically coupled to the MEMS RF switch module.

2. The system of claim 1 wherein the system is a wireless device.

3. The system of claim 1 wherein the MEMS RF switch module to switch from a first RF band to a second RF band to transmit an RF signal by the system.

4. The system of claim 1 wherein the MEMS RF switch module comprises a trace ring to electrically couple the RF switch array to a first vertical via of the at least one vertical via, the trace ring surrounding at least a portion of the RF switch array to allow a signal to transit the MEMS RF switch module using a second vertical via of the at least one vertical via without crossing the trace ring.

5. A method, comprising:

receiving a Radio Frequency (RF) signal at a Micro-electromechanical System (MEMS) Radio Frequency (RF) switch module through a first vertical via of the MEMS RF switch module, the first vertical via electrically coupled to an RF switch array of the MEMS RF switch module;

transiting the RF signal through at least one switch of the RF switch array; and

outputting the RF signal from the MEMS RF switch module.

6. The method of claim 5 wherein outputting the RF signal comprises outputting the RF signal through a second vertical via of the MEMS RF switch module, the second vertical via electrically coupled to the RF switch array.

7. The method of claim 5, further comprising receiving an actuation signal at the MEMS RF switch module to actuate the at least one switch.

8. The method of claim 7 wherein receiving the actuation signal comprises receiving the actuation signal through a third vertical via of the MEMS RF switch module, the third vertical via electrically coupled to the RF switch array.