Mounting arrangement for light emitting diodes

• US 20070030683A1
• Filed: 10/03/2006
• Published: 02/08/2007
• Est. Priority Date: 10/19/1999
• Status: Active Grant

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Popovich, John, Honegger, Gregory
• Granted Patent: US 7,306,353 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: A47C 7/725 for illumination, e.g. lamps
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 7/0025 Combination of two or more reflectors for a single light source array of reflectors for a cluster of light sources F21V7/0083
• CPC Class Codes: F21V 7/005 with an elongated shape to cooperate with linear light sources
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10S 362/80 : Light emitting diode
• CPC Class Codes: Y10T 29/49133 : with component orienting
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Claims

1. An illumination apparatus, comprising:

a housing comprising a housing body and a light-transmissive cover, the housing body and cover cooperating to define an enclosed space, the housing body comprising a heat conductive base configured to function as a heat sink;

a lighting module formed separately from the housing, the lighting module comprising;

at least one light emitting diode (LED);

a dielectric having first and second sides;

plural electrically-conductive contacts on the first side of the dielectric, the contacts being configured to mount the at least one LED such that the at least one LED is electrically connected to the contacts; and

a heat conductive body connected to the second side of the dielectric; and

a fastener;

wherein the lighting module is adapted to be attachable by the fastener to the base within the enclosed housing space so that heat from the at least one LED flows through the dielectric to the heat conductive body and to the base.

2. An illumination apparatus as in claim 1 additionally comprising a power conditioner adapted to rectify an AC input power to a DC output power and to deliver such conditioned power to the lighting module, wherein the power conditioner is disposed adjacent the heat conductive base.

3. An illumination apparatus as in claim 2, wherein the power conditioner is enclosed in the space within the housing.

4. An illumination apparatus as in claim 1, wherein the fastener comprises an elongate fastener.

5. An illumination apparatus as in claim 4, wherein the base comprises an aperture adapted to accommodate the fastener in order to attach the lighting module on the base.

6. An illumination apparatus as in claim 5, wherein the lighting module body comprises an aperture configured to accommodate the fastener.

7. An illumination apparatus as in claim 6, wherein the fastener comprises a rivet.

8. An illumination apparatus as in claim 1, wherein the fastener comprises an adhesive.

9. An illumination apparatus as in claim 1, wherein the fastener comprises a clip.