Methods of forming memory circuitry
First Claim
1. A method of forming memory circuitry, comprising:
- providing a substrate having a memory array circuitry area and a peripheral circuitry area, the memory array circuitry area comprising transistor gate lines having a first minimum line spacing, the peripheral circuitry area comprising transistor gate lines having a second minimum line spacing which is greater than the first minimum line spacing; and
forming anisotropically etched insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the peripheral circuitry area prior to forming anisotropically etched insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the memory array area.
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Accused Products
Abstract
The invention includes methods of forming memory circuitry. In one implementation, a substrate is provided which has a memory array circuitry area and a peripheral circuitry area. The memory array circuitry area comprises transistor gate lines having a first minimum line spacing. The peripheral circuitry area comprises transistor gate lines having a second minimum line spacing which is greater than the first minimum line spacing. Anisotropically etched insulative sidewall spacers are formed over opposing sidewalls of individual of said transistor gate lines within the peripheral circuitry area prior to forming anisotropically etched insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the memory array area. Other aspects and implementations are contemplated.
43 Citations
22 Claims
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1. A method of forming memory circuitry, comprising:
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providing a substrate having a memory array circuitry area and a peripheral circuitry area, the memory array circuitry area comprising transistor gate lines having a first minimum line spacing, the peripheral circuitry area comprising transistor gate lines having a second minimum line spacing which is greater than the first minimum line spacing; and
forming anisotropically etched insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the peripheral circuitry area prior to forming anisotropically etched insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the memory array area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming memory circuitry, comprising:
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providing a substrate having a memory array circuitry area and a peripheral circuitry area, the memory array circuitry area comprising transistor gate lines having a first minimum line spacing, the peripheral circuitry area comprising transistor gate lines having a second minimum line spacing which is greater than the first minimum line spacing;
masking spaces between the transistor gate lines within the memory array circuitry area while forming anisotropically etched insulative sidewall spacers over the transistor gate lines within the peripheral circuitry area and not within said spaces between the transistor gate lines within the memory array circuitry area; and
masking spaces between the transistor gate lines within the peripheral circuitry area while forming anisotropically etched insulative sidewall spacers over the transistor gate lines within the memory array circuitry area and not within said spaces between the transistor gate lines within the peripheral circuitry area. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of forming memory circuitry, comprising:
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providing a substrate having a memory array circuitry area and a peripheral circuitry area, the memory array circuitry area comprising transistor gate lines having a first minimum line spacing, the peripheral circuitry area comprising transistor gate lines having a second minimum line spacing which is greater than the first minimum line spacing;
forming first insulative spacer material over the transistor gate lines within the memory array circuitry area and the peripheral circuitry area;
forming second insulative spacer material over the first insulative spacer material and over the transistor gate lines within the memory array circuitry area and the peripheral circuitry area, the second insulative spacer material being selectively etchable relative to the first insulative spacer material, the second insulative spacer material filling spaces between the transistor gate lines within the memory array circuitry area and not filling spaces between the transistor gate lines within the peripheral circuitry area;
anisotropically etching the second insulative spacer material selectively relative to the first insulative spacer material effective to form insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the peripheral circuitry area;
after forming said sidewall spacers within the peripheral circuitry area, etching the second insulative spacer material selectively relative to the first insulative spacer material within the memory array circuitry area while said sidewall spacers within the peripheral circuitry area are masked; and
anisotropically etching the first insulative spacer material effective to form insulative sidewall spacers over opposing sidewalls of individual of said transistor gate lines within the memory array circuitry area. - View Dependent Claims (17)
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18. A method of forming memory circuitry, comprising:
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providing a substrate having a memory array circuitry area and a peripheral circuitry area, the memory array circuitry area comprising transistor gate lines having a first minimum line spacing, the peripheral circuitry area comprising transistor gate lines having a second minimum line spacing which is greater than the first minimum line spacing; and
forming elevated source/drain regions comprising epitaxially grown semiconductive material within spaces between the transistor gate lines within the memory array circuitry area and not within spaces between the transistor gate lines within the peripheral circuitry area. - View Dependent Claims (19, 20, 21, 22)
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Specification