Diode housing

• US 20070034889A1
• Filed: 10/23/2006
• Published: 02/15/2007
• Est. Priority Date: 06/30/1998
• Status: Active Grant

• Current Assignee: OSRAM GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Waitl, Gunther
• Granted Patent: US 7,368,329 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

Claims

1-20. -20. (canceled)

21. A method of forming an apparatus for sending or receiving radiation, said method comprising the steps of

preparing a conductor, said conductor having at least one first conductor portion and at least one second conductor portion, both conductor portions being electrically insulated from each other,

forming a housing material around said conductor, said housing including an opening with an open top and a closed bottom such that said first conductor portion has a first open area exposed along said closed bottom and that said second conductor portion has a second open area exposed along said bottom, and

electrically connecting a semiconductor chip to said first and second open area.

22. The method according to claim 21, wherein the housing material is a reflective material.

23. The method according to claim 21, wherein said housing material features a diffuse reflective degree of at least 80%.

24. The method according to claim 21, wherein said housing material is a non-reflective material.

25. The method according to claim 21, wherein said first and second open area is the only part of said first and second conductor portion within said opening that is free from said housing material.

26. The method according to claim 21, wherein a first cropping of the first conductor portion is produced by bowing or cropping the first conductor portion in the region of the first open area.

27. The method according to claim 26, wherein the first cropping rises above the remainder of said first conductor portion.

28. The method according to claim 21, wherein a second cropping of the second conductor portion is produced by bowing or cropping the second conductor portion in the region of the second open area.

29. The method according to claim 28, wherein the second cropping rises above the remainder of said second conductor portion.

30. The method according to claim 21, wherein said opening is filled with a transparent material thereby casting said semiconductor chip.

31. The method according to claim 21, wherein said first and second conductor portions are co-planar.

32. The method according to claim 21, wherein said apparatus is surface-mountable.