×

Differential chip performance within a multi-chip package

  • US 20070035007A1
  • Filed: 08/15/2005
  • Published: 02/15/2007
  • Est. Priority Date: 08/15/2005
  • Status: Active Grant
First Claim
Patent Images

1. A multi-chip package, comprising:

  • a die of the multi-chip package comprising an integrated circuit and a device; and

    a plurality of contact pads disposed on the die and coupled to the integrated circuit;

    wherein the plurality of contact pads comprises a mode pad disposed on the die, wherein the mode pad being placed at different potentials causes the device to operate in one of at least two modes, the mode being selected based on a position of the die in the multi-chip package relative to at least one other die in the multi-chip package.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×