Differential chip performance within a multi-chip package
First Claim
1. A multi-chip package, comprising:
- a die of the multi-chip package comprising an integrated circuit and a device; and
a plurality of contact pads disposed on the die and coupled to the integrated circuit;
wherein the plurality of contact pads comprises a mode pad disposed on the die, wherein the mode pad being placed at different potentials causes the device to operate in one of at least two modes, the mode being selected based on a position of the die in the multi-chip package relative to at least one other die in the multi-chip package.
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Accused Products
Abstract
A multi-chip package comprises a first die comprising a first integrated circuit and a second die comprising a second integrated circuit. A first plurality of contact pads disposed on the first die are coupled to the first integrated circuit, wherein the first plurality of contact pads comprises a first mode pad coupled to a first device formed on the first die. The first mode pad is coupled to a first potential and causes the first device to operate in a first mode. A second plurality of contact pads disposed on the second die are coupled to the second integrated circuit. The second plurality of contact pads comprises a second mode pad coupled to a second device formed on the second die. The second mode pad is coupled to a second potential and causes the second device to operate in a second mode. The first mode and the second mode are selected based on the relative position of the first die and the second die.
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Citations
22 Claims
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1. A multi-chip package, comprising:
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a die of the multi-chip package comprising an integrated circuit and a device; and
a plurality of contact pads disposed on the die and coupled to the integrated circuit;
wherein the plurality of contact pads comprises a mode pad disposed on the die, wherein the mode pad being placed at different potentials causes the device to operate in one of at least two modes, the mode being selected based on a position of the die in the multi-chip package relative to at least one other die in the multi-chip package. - View Dependent Claims (2, 3, 4)
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5. A multi-chip package, comprising:
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a first die of the multi-chip package comprising a first integrated circuit;
a first plurality of contact pads disposed on the first die and coupled to the first integrated circuit, wherein the first plurality of contact pads comprises a first mode pad coupled to a first device formed on the first die, wherein the first mode pad is coupled to a first potential and causes the first device to operate in a first mode;
a second die of the multi-chip package comprising a second integrated circuit;
a second plurality of contact pads disposed on the second die and coupled to the second integrated circuit, wherein the second plurality of contact pads comprises a second mode pad coupled to a second device formed on the second die, wherein the second mode pad is coupled to a second potential and causes the second device to operate in a second mode, the first mode and the second mode being selected based on the relative position of the first die and the second die. - View Dependent Claims (6, 7, 8, 9)
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10. A multi-chip package, comprising:
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a substrate;
at least two dies disposed on the substrate, each die comprising a contact plurality of pads and a mode pad coupled to a device formed on the respective die, wherein the mode pad of at least one of the dies is coupled to a first potential causing the respective device to operate in a first mode and wherein the mode pad of at least one other die is coupled to a second potential causing the respective device to operate in a second mode, the mode being selected based on a relative position of the respective dies in the multi-chip package; and
wire bonds coupling the plurality of contract pads to contact elements of the substrate, thereby creating signal paths between the respective dies and the substrate. - View Dependent Claims (11, 12, 13, 14)
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15. A multi-chip memory package, comprising:
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a first die of a multi-chip package comprising a first memory circuit;
a first plurality of contact pads disposed on the first die and coupled to the first memory circuit, wherein the first plurality of contact pads comprises a first mode pad coupled to a first device formed on the first die, wherein the first mode pad is coupled to a first potential and causes the first device to operate in a first mode;
a second die of the multi-chip package comprising a second memory circuit;
a second plurality of contact pads disposed on the second die and coupled to the second memory circuit, wherein the second plurality of contact pads comprises a second mode pad coupled to a second device formed on the second die, wherein the second mode pad is coupled to a second potential and causes the second device to operate in a second mode, the first mode and the second mode being selected based on the relative position of the first die and the second die. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A method of packaging integrated circuits in a multi-chip package, the method comprising:
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coupling a first plurality of contact pads disposed on a first die to a substrate, wherein the first die comprises a first integrated circuit coupled to the first plurality of contact pads and a first device coupled to a first mode selection pad;
coupling the first mode selection pad to a first potential on the substrate, wherein coupling the first mode selection pad to the first potential causes the first device to operate in a first mode;
coupling a second plurality of contact pads disposed on a second die to the substrate, wherein the second die comprises a second integrated circuit coupled to the second plurality of contact pads and a second device coupled to a second mode selection pad;
coupling the second mode selection pad to a second potential on the substrate, wherein coupling the second mode selection pad to the second potential causes the second device to operate in a second mode; and
selecting the first mode and the second mode based on the relative position of the first die and the second die.
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22. A multi-chip package, comprising:
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means for supporting circuitry;
means for housing a first integrated circuit, the means for housing the first integrated circuit disposed on the means for supporting, the means for housing the first integrated circuit comprising a means for connecting to the first integrated circuit and a means for selecting a mode of a first device formed on the means for housing the first integrated circuit, wherein the means for selecting the mode of the first device is connected to a first potential causing the first device to operate in a first mode;
means for housing a second integrated circuit, the means for housing the second integrated circuit disposed on the means for supporting, the means for housing the second integrated circuit comprising a means for connecting to the second integrated circuit and a means for selecting a mode of a second device formed on the means for housing the second integrated circuit, wherein the means for selecting the mode of the second device is connected to a second potential causing the second device to operate in a second mode;
the first and second mode being selected based on a relative position of the means for housing the first integrated circuit and the means for housing the second integrated circuit in the multi-chip package; and
means for coupling the means for connecting to the first integrated circuit and the means for connecting to the second integrated circuit to contact elements disposed on the means for supporting, thereby creating signal paths between the respective means for housing and the means for supporting.
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Specification