Integrated solder and heat spreader fabrication
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Abstract
A system may include an integrated heat spreader that includes a portion of solder material and a thermal conductor, wherein a voidless interface exists between the solder material and a first side of the thermal conductor.
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Citations
20 Claims
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1-10. -10. (canceled)
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11. A method comprising:
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removing portions of solder material from a first side of a composite strip, the composite strip comprising a strip of solder material clad to the first side of a strip of thermal conductor, wherein removing the portions of solder material leaves a plurality of discontinuous portions of solder material clad to the first side of the strip of thermal conductor. - View Dependent Claims (12, 13, 14, 15)
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16. A method comprising:
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placing a piece of solder material on a thermal conductor to substantially create a point or line contact between the piece of solder material and the thermal conductor;
applying pressure to the piece of solder material to create a voidless interface between the piece of solder material and the thermal conductor. - View Dependent Claims (17, 18, 19)
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20-23. -23. (canceled)
Specification