Fluid-ejecting integrated circuit utilizing electromagnetic displacement

• US 20070035585A1
• Filed: 10/20/2006
• Published: 02/15/2007
• Est. Priority Date: 07/15/1997
• Status: Active Grant

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Granted Patent: US 7,695,108 B2
• Time in Patent Office: Days
• US Class Current: 347/50
• CPC Class Codes: B41J 2/04 generating single droplets or particles on demand
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14314 Structure of ink jet print heads with electrostatically actuated membrane
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/17503 Ink cartridges
• CPC Class Codes: B41J 2/17513 Inner structure
• CPC Class Codes: B41J 2/17596 : Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 : Electromagnetic transducer
• CPC Class Codes: B41J 2202/21 : Line printing
• CPC Class Codes: G06F 21/79 : in semiconductor storage media, e.g. directly-addressable memories
• CPC Class Codes: G06F 21/86 : Secure or tamper-resistant housings
• CPC Class Codes: G06F 2221/2129 : Authenticate client device independently of the user
• CPC Class Codes: G06K 1/121 : by printing code marks applying code marks to labels B65C9/46; marking or coding completed packages B65B61/26
• CPC Class Codes: G06K 19/06037 : multi-dimensional coding
• CPC Class Codes: G06K 19/073 : Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 7/14 : using light without selection of wavelength, e.g. sensing reflected white light G06K7/10831 - G06K7/1097 take precedence
• CPC Class Codes: G06K 7/1417 : 2D bar codes
• CPC Class Codes: G11C 11/56 : using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
• CPC Class Codes: H04N 1/2112 : using still video cameras
• CPC Class Codes: H04N 1/2154 : the still video camera incorporating a hardcopy reproducing device, e.g. a printer
• CPC Class Codes: H04N 2101/00 : Still video cameras
• CPC Class Codes: H04N 23/00 : Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 5/2628 : Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation

Abstract

A fluid ejecting integrated circuit includes a wafer substrate. A drive circuitry layer is positioned on the wafer substrate. A protective passivation layer is positioned on the drive circuitry layer. A nozzle chamber wall extends from the passivation layer and a roof wall is positioned on the nozzle chamber wall such that the nozzle chamber wall and the roof wall define a nozzle chamber and a fluid ejection port in fluid communication with the nozzle chamber. A fluid ejecting member overlies the passivation layer within the nozzle chamber and is configured to be displaced to eject fluid through the fluid ejection port. A pair of spaced apart electrodes is connected to the drive circuitry layer so that the drive circuitry layer can create a potential difference between the electrodes, with one of the electrodes fast with the fluid ejecting member to displace the fluid ejecting member as a result of the potential difference.

Claims

1. A fluid ejecting integrated circuit (IC), the IC comprising:

a wafer substrate;

a drive circuitry layer positioned on the wafer substrate;

a protective passivation layer positioned on the drive circuitry layer;

a nozzle chamber wall extending from the passivation layer and a roof wall positioned on the nozzle chamber wall such that the nozzle chamber wall and the roof wall define a nozzle chamber and a fluid ejection port in fluid communication with the nozzle chamber;

a fluid ejecting member which overlies the passivation layer within the nozzle chamber and is configured to be displaced to eject fluid through the fluid ejection port; and

a pair of spaced apart electrodes each connected to the drive circuitry layer so that the drive circuitry layer can create a potential difference between the electrodes, with one of the electrodes fast with the fluid ejecting member to displace the fluid ejecting member as a result of said potential difference.

2. A fluid ejecting IC as claimed in claim 1, wherein the electrodes are in the form of one planar electrode embedded in the passivation layer and another planar electrode fast with the fluid ejecting member.

3. A fluid ejecting IC as claimed in claim 2, wherein a support formation is interposed between the fluid ejecting member and the passivation layer to support the fluid ejecting member in a spaced condition with respect to the passivation layer.

4. A fluid ejecting IC as claimed in claim 3, wherein the support formation is continuous and defines a sealed air chamber between the electrodes.

5. A fluid ejecting IC as claimed in claim 4, wherein the embedded electrode is coated with a plastic layer which is located between the electrodes and whose periphery endlessly contacts the inside of the support formation.

6. A fluid ejecting IC as claimed in claim 4, wherein at least one coating layer of silicon nitride is arranged on the electrode of the fluid ejecting member to enhance resilience of the fluid ejecting member.

7. A fluid ejecting IC as claimed in claim 2, wherein a projection is positioned on the fluid ejecting member to inhibit stiction during deflection of the fluid ejecting member.

8. A fluid ejecting IC as claimed in claim 1, wherein the nozzle chamber wall defines one or more fluid inlet openings through which fluid can be fed into the nozzle chamber.

9. A fluid ejecting IC as claimed in claim 1, wherein the roof wall defines a raised rim which bounds the fluid ejection port.