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Solder composition

  • US 20070036670A1
  • Filed: 02/22/2006
  • Published: 02/15/2007
  • Est. Priority Date: 08/12/2005
  • Status: Abandoned Application
First Claim
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1. A solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin and about 15% to 65% indium.

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