Solder composition
First Claim
Patent Images
1. A solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin and about 15% to 65% indium.
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Abstract
A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.
63 Citations
63 Claims
- 1. A solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin and about 15% to 65% indium.
- 8. A solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin, about 13% to 65% indium, and about 0.25% to 4% bismuth.
- 16. A solder composition having a mixture of elements comprising tin, indium, silver, bismuth and copper, and including about 30% to 85% tin and about 13% to 65% indium.
- 28. A solder composition comprising tin, indium and silver, and including more than about 60% tin, the composition having a solidus temperature below about 330°
- 32. A method of forming a solder composition comprising mixing tin, indium, silver, and bismuth together, and including about 30% to 85% tin and about 15% to 65% indium.
- 39. A method of forming a solder composition comprising mixing tin, indium, silver, and bismuth together, and including about 30% to 85% tin, about 13% to 65% indium, and about 0.25% to 4% bismuth.
- 47. A method of forming a solder composition comprising mixing tin, indium, silver, bismuth and copper together, and including about 30% to 85% tin and about 13% to 65% indium.
- 59. A method forming a solder composition comprising mixing tin, indium and silver together, including more than about 60% tin, and providing the composition with a solidus temperature below about 330°
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63. A method of soldering comprising:
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providing a solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin and about 15% to 65% indium; and
melting the solder composition with a soldering device.
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Specification