Structure and method for forming inter-poly dielectric in a shielded gate field effect transistor
First Claim
Patent Images
1. A method of forming a field effect transistor, comprising:
- forming a trench in a silicon region of a first conductivity type, the trench having a shield electrode insulated from the silicon region by a shield dielectric;
forming an inter-poly dielectric (IPD) comprising a layer of thermal oxide and a layer of conformal dielectric along an upper surface of the shield electrode;
forming a gate dielectric lining at least upper trench sidewalls; and
forming a gate electrode in the trench, the gate electrode being insulated from the shield electrode by the IPD.
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Abstract
A shielded gate trench FET is formed as follows. A trench is formed in a silicon region of a first conductivity type, the trench including a shield electrode insulated from the silicon region by a shield dielectric. An inter-poly dielectric (IPD) including a layer of thermal oxide and a layer of conformal dielectric is formed along an upper surface of the shield electrode. A gate dielectric lining at least upper trench sidewalls is formed. A gate electrode is formed in the trench such that the gate electrode is insulated from the shield electrode by the IPD.
56 Citations
33 Claims
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1. A method of forming a field effect transistor, comprising:
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forming a trench in a silicon region of a first conductivity type, the trench having a shield electrode insulated from the silicon region by a shield dielectric;
forming an inter-poly dielectric (IPD) comprising a layer of thermal oxide and a layer of conformal dielectric along an upper surface of the shield electrode;
forming a gate dielectric lining at least upper trench sidewalls; and
forming a gate electrode in the trench, the gate electrode being insulated from the shield electrode by the IPD. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A field effect transistor (FET) comprising:
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a trench extending into a silicon region of a first conductivity type;
a shield electrode in a lower portion of the trench, the shield electrode being insulated from the silicon region by a shield dielectric; and
a gate electrode in the trench over but insulated from the shield electrode by an inter-poly dielectric (IPD), the IPD comprising a conformal layer of dielectric and a thermal oxide layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A field effect transistor (FET) comprising:
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a trench extending into a silicon region of a first conductivity type;
a shield electrode in a lower portion of the trench, the shield electrode being insulated from the silicon region by a shield dielectric; and
a gate electrode in the trench over but insulated from the shield electrode by an inter-poly dielectric (IPD) having a concave profile along its upper surface. - View Dependent Claims (24, 25, 26, 27)
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28. A field effect transistor (FET) comprising:
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a trench extending into a silicon region of a first conductivity type;
a shield electrode in a lower portion of the trench, the shield electrode being insulated from the silicon region by a shield dielectric; and
a gate electrode in the trench over but insulated from the shield electrode by an inter-poly dielectric (IPD), the IPD comprising a conformal layer of dielectric which has a convex profile along its lower surface and a concave profile along its upper surface. - View Dependent Claims (29, 30, 31, 32, 33)
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Specification