Electronic component and method of manufacturing the same

• US 20070040163A1
• Filed: 08/07/2006
• Published: 02/22/2007
• Est. Priority Date: 08/18/2005
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Yoshida, Makoto, Okuzawa, Nobuyuki
• Granted Patent: US 8,050,045 B2
• Time in Patent Office: Days
• US Class Current: 257/31
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0093 Common mode choke coil
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 428/24331 including nonapertured component

Abstract

The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.

Claims

1. An electronic component incorporating a passive element, comprising:

a first conductive layer electrically connected to the passive element;

a top insulation layer formed on the first conductive layer; and

an external electrode which is electrically connected to the first conductive layer through a contact hole formed in the top insulation layer and which is formed to spread on a top surface of the top insulation layer.

2. An electronic component according to claim 1, comprising:

a first insulation layer formed between the first conductive layer and the top insulation layer; and

a second conductive layer electrically connected to the first conductive layer through a contact hole formed in the first insulation layer, wherein the external electrode is electrically connected to the first conductive layer through the second conductive layer.

3. An electronic component according to claim 2, comprising:

a second insulation layer formed between the second conductive layer and the top insulation layer; and

a third conductive layer electrically connected to the second conductive layer through a contact hole formed in the second insulation layer, wherein the external electrode is electrically connected to the first conductive layer through the second and the third conductive layers.

4. An electronic component according to claim 3, comprising:

a third insulation layer formed between the third conductive layer and the top insulation layer; and

a fourth conductive layer electrically connected to the third conductive layer through a contact hole formed in the third insulation layer, wherein the external electrode is electrically connected to the first conductive layer through the second to the fourth conductive layers.

5. An electronic component according to claim 4, wherein:

the first to the fourth conductive layers are formed from at least any of copper, aluminum, silver, and gold; and

the external electrode is formed from silver or gold.

6. An electronic component according to claim 1, wherein a bottom insulation layer is formed under the first conductive layer.

7. An electronic component according to claim 6, wherein the bottom insulation layer is formed on a substrate.

8. An electronic component according claim 4, wherein the first to the fourth conductive layers are not exposed at a side surface of the first to the third insulation layers and the top insulation layer.

9. An electronic component according to claim 4, wherein the first to the fourth conductive layers are exposed at a side surface of the first to the third insulation layers and the top insulation layer.

10. An electronic component according to claim 4, wherein the passive element is a common mode choke coil.

11. A method of manufacturing an electronic component incorporating a passive element, comprising the steps of:

forming a first conductive layer on a substrate;

forming a top insulation layer on the first conductive layer;

forming a contact hole in the top insulation layer on the first conductive layer; and

forming an external electrode which is electrically connected to the first conductive layer through the contact hole and which spreads on a top surface of the top insulation layer.

12. A method of manufacturing an electronic component according to claim 11, comprising the steps of:

forming a first insulation layer between the first conductive layer and the top insulation layer;

forming a contact hole in the first insulation layer on the first conductive layer;

forming a second conductive layer electrically connected to the first conductive layer through the contact hole; and

electrically connecting the external electrode to the first conductive layer through the second conductive layer.

13. A method of manufacturing an electronic component according to claim 12, comprising the steps of:

forming a second insulation layer between the second conductive layer and the top insulation layer;

forming a contact hole in the second insulation layer on the second conductive layer;

forming a third conductive layer electrically connected to the second conductive layer through the contact hole; and

electrically connecting the external electrode to the first conductive layer through the second and the third conductive layers.

14. A method of manufacturing an electronic component according to claim 13, comprising the steps of:

forming a third insulation layer between the third conductive layer and the top insulation layer;

forming a contact hole in the third insulation layer on the third conductive layer;

forming a fourth conductive layer electrically connected to the third conductive layer through the contact hole; and

electrically connecting the external electrode to the first conductive layer through the second to the fourth conductive layers.

15. A method of manufacturing an electronic component according to claim 14, wherein:

the first to the fourth conductive layers are formed from at least any of copper, aluminum, silver, and gold; and

the external electrode is formed from silver or gold.

16. A method of manufacturing an electronic component according to claim 11, wherein a bottom insulation layer is formed between the substrate and the first conductive layer.

17. A method of manufacturing an electronic component according to claim 11, wherein the first to the fourth conductive layers are not exposed at a side surface of the first to the third insulation layers and the top insulation layer even when the substrate is cut.

18. A method of manufacturing an electronic component according to claim 11, comprising the step of cutting the substrate to expose the first to the fourth conductive layers at a side surface of the first to the third insulation layers and the top insulation layer.

19. A method of manufacturing an electronic component according to claim 11, comprising the step of removing the substrate.

20. A method of manufacturing an electronic component according to claim 14, wherein a common mode choke coil is formed as the passive element.