Partially etched leadframe packages having different top and bottom topologies

• US 20070040231A1
• Filed: 01/24/2006
• Published: 02/22/2007
• Est. Priority Date: 08/16/2005
• Status: Abandoned Application

• Current Assignee: IQLP, LLC
• Original Assignee: IQLP, LLC
• Inventors: Martin, John, Felton, Lawrence, Harney, Kieran
• Application Number:
  US11/338,439
• Publication Number:
  US 20070040231A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.

Claims

1. A package for a micro-electromechanical (MEMS) device comprising:

a premolded leadframe base having opposing top and bottom surfaces, each surface being defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion,

wherein the topology of the top surface is substantially different from the topology of the bottom surface.

2. A package according to claim 1, wherein at least one electrically conductive portion on the top surface is connected to at least one electrically conductive portion on the bottom surface.

3. A package according to claim 1, further comprising:

a device cover coupled to the leadframe base, the cover and the base together defining an interior volume containing one or more MEMS devices.

4. A package according to claim 3, wherein the device cover shields devices within the interior volume from electromagnetic interference.

5. A package according to claim 3, wherein at least one of the device cover and the leadframe base includes an opening adapted to allow sound to enter the interior volume.

6. A package according to claim 1, further comprising:

a MEMS microphone die coupled to the leadframe base.

7. A package according to claim 6, further comprising:

an ASIC die coupled to the leadframe base.

8. A method of developing a package for a micro-electromechanical (MEMS) device, the method comprising:

developing a premolded leadframe base having opposing top and bottom surfaces, each surface being defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion,

wherein the topology of the top surface is substantially different from the topology of the bottom surface.

9. A method according to claim 8, wherein at least one electrically conductive portion on the top surface is connected to at least one electrically conductive portion on the bottom surface.

10. A method according to claim 8, further comprising:

coupling a device cover to the leadframe base such that the cover and the base together define an interior volume containing one or more MEMS devices.

11. A method according to claim 10, wherein the device cover shields devices within the interior volume from electromagnetic interference.

12. A method according to claim 10, further comprising:

including in at least one of the device cover and the leadframe base an opening adapted to allow sound to enter the interior volume.

13. A method according to claim 8, further comprising:

coupling a MEMS microphone die to the leadframe base.

14. A method according to claim 13, further comprising:

coupling an ASIC die to the leadframe base.

15. A package for a micro-electromechanical (MEMS) device comprising:

means for developing a premolded leadframe base having opposing top and bottom surfaces, each surface being defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion,

wherein the topology of the top surface is substantially different from the topology of the bottom surface.

16. A package according to claim 15, wherein at least one electrically conductive portion on the top surface is connected to at least one electrically conductive portion on the bottom surface.

17. A package according to claim 15, further comprising:

means for coupling a device cover to the leadframe base such that the cover and the base together define an interior volume containing one or more MEMS devices.

18. A package according to claim 17, wherein the device cover shields devices within the interior volume from electromagnetic interference.

19. A package according to claim 15, further comprising:

means for including in at least one of the device cover and the leadframe base an opening adapted to allow sound to enter the interior volume.

20. A package according to claim 15, further comprising:

means for coupling a MEMS microphone die to the leadframe base.

21. A package according to claim 20, further comprising:

means for coupling an ASIC die to the leadframe base.