Chip packages with covers
First Claim
Patent Images
1. A unit comprising:
- (a) a crystalline substrate having a microstructure, said crystalline substrate having a front face and electrically conductive pads adjacent the front face;
(b) a cover overlying the front face of the crystalline substrate, the cover being spaced from said front face so that said cover and said front face define at least one cavity therebetween, the cover and the crystalline substrate cooperatively defining a chip scale package having planar surfaces and edge surfaces, the pads of the crystalline substrate extending to at least some of the edge surfaces; and
(c) contacts connected to the pads extending along at least one of said edge surfaces and onto at least one of the planar surfaces.
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Abstract
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.
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Citations
26 Claims
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1. A unit comprising:
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(a) a crystalline substrate having a microstructure, said crystalline substrate having a front face and electrically conductive pads adjacent the front face;
(b) a cover overlying the front face of the crystalline substrate, the cover being spaced from said front face so that said cover and said front face define at least one cavity therebetween, the cover and the crystalline substrate cooperatively defining a chip scale package having planar surfaces and edge surfaces, the pads of the crystalline substrate extending to at least some of the edge surfaces; and
(c) contacts connected to the pads extending along at least one of said edge surfaces and onto at least one of the planar surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A unit comprising:
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(a) a crystalline substrate having a microstructure, said crystalline substrate having a front face, a rear face, edges extending between the front and rear faces and electrically conductive pads adjacent the front face extending to at least some edges of the crystalline substrate;
(b) a cover overlying the front face of the crystalline substrate, the cover being spaced apart from said front face so that said cover and said front face define at least one cavity therebetween, the cover and the crystalline substrate cooperatively defining a chip scale package; and
(c) contacts connected to the pads extending away from the cover along at least one of said edges of the crystalline substrate and extending over the rear face of the crystalline substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification