Semiconductor device and method of producing the same

• US 20070040281A1
• Filed: 08/18/2006
• Published: 02/22/2007
• Est. Priority Date: 08/22/2005
• Status: Abandoned Application

• Current Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International), Sony Corporation (Sony Group Corp.)
• Original Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International), Sony Corporation (Sony Group Corp.)
• Inventors: Nakayama, Hirokazu, Beyne, Eric, Miyazaki, Hirohito, Okubora, Akihiko, Baert, Kris, De Moor, Piet, De Wolf, Ingrid, Oya, Yoichi
• Application Number:
  US11/506,517
• Publication Number:
  US 20070040281A1
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

To provide a semiconductor device configured that a micro device having a device substrate, a function element provided on the device substrate and having an oscillator or a movable part, first lands provided on a surface of the device substrate by being arranged on its outer circumference portion of the function element, and bumps provided to the first lands is mounted on the circuit board having second lands formed to correspond to the bumps, from the bump formation surface side, so that the bumps and the second lands are electrically connected; on which a sealing resin layer is formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands, and to seal a clearance between the device substrate and the circuit board; and a cavity portion is formed between the function element and the circuit board.

Claims

1. A semiconductor device comprising:

a micro device having a device substrate, a function element provided on a surface of the device substrate and having an oscillator or a movable part, first lands provided on the surface of the device substrate by being arranged on an outer circumference portion of the function element, and bumps provided to the first lands;

a circuit board having second lands formed to correspond to the bumps thereon the micro device is mounted from the bump formation surface side so that the bumps and the second lands are electrically connected;

a sealing resin layer formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands and to seal a clearance between the device substrate and the circuit board;

wherein a cavity portion is formed between the function element and the circuit board.

2. A semiconductor device as set forth in claim 1, wherein the cavity portion configured by inner wall surfaces of the device substrate, the function element, the circuit board and the sealing resin layer is kept to be vacuum, decompressed, a reducing atmosphere or an inert gas atmosphere.

3. A semiconductor device as set forth in claim 1, wherein a formation surface of the second lands of the circuit board is flattened.

4. A semiconductor device as set forth in claim 1, wherein a level difference between the second lands and a part excepting the second lands is 10% or less of a film thickness of the sealing resin layer on the formation surface of the second lands of the circuit board.

5. A semiconductor device as set forth in claim 1, wherein solder ball bumps for circuit board is formed on the other surface of the surface mounted with the micro device of the circuit board.

6. A semiconductor device as set forth in claim 1, wherein

in the micro device, a cap is bonded on the device substrate to form the cavity portion to protect the function element, and

the sealing resin layer is formed to go round an outer circumference portion of the function element.

7. A semiconductor device as set forth in claim 6, wherein

the circuit board is formed with a recessed portion corresponding to the cap, and

the micro device is mounted on the circuit board so that the cap is inserted to the recessed portion.

8. A semiconductor device comprising:

a micro device having a device substrate, a function element provided on a surface of the device substrate and having an oscillator or a movable part, and first lands provided on the surface of the device substrate by being arranged on an outer circumference portion of the function element;

a circuit board having second lands formed to correspond to the first lands and bumps provided to the second lands thereon the micro device is mounted from the first land formation surface side so that the bumps and the first lands are electrically connected;

a sealing resin layer formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the first lands and to seal a clearance between the device substrate and the circuit board;

wherein a cavity portion is formed between the function element and the circuit board.

9. A semiconductor device as set forth in claim 8, wherein the cavity portion configured by inner wall surfaces of the device substrate, the function element, the circuit board and the sealing resin layer is kept to be vacuum, decompressed, a reducing atmosphere or an inert gas atmosphere.

10. A semiconductor device as set forth in claim 8, wherein solder ball bumps for circuit board is formed on the other surface of the surface mounted with the micro device of the circuit board.

11. A semiconductor device as set forth in claim 8, wherein

in the micro device, a cap is bonded on the device substrate to form the cavity portion to protect the function element, and

the sealing resin layer is formed to go round an outer circumference portion of the function element.

12. A semiconductor device as set forth in claim 11, wherein

the circuit board is formed with a recessed portion corresponding to the cap, and

the micro device is mounted on the circuit board so that the cap is inserted to the recessed portion.

13. A method of producing a semiconductor device including mounting a micro device having a device substrate, a function element provided to a surface of the device substrate and having an oscillator or a movable part, first lands provided to the surface of the device substrate by being arranged on an outer circumference portion of the function element, and bumps provided to the first lands to a circuit board having second lands formed to correspond to the bumps, the method comprising the steps of:

forming an uncured sealing resin layer on the second lands so as to go round the outer circumference portion of the function element by including a second land formation region of the circuit board;

mounting the micro device to the circuit board from the bump formation surface side so that the bumps penetrate the sealing resin layer to contact and electrically connect to the second lands and the sealing resin layer seals a clearance between the device substrate and the circuit board; and

curing the sealing resin layer to fix connection portions of the bumps and the second lands.

14. A method of producing a semiconductor device as set forth in claim 13, wherein the step of mounting the micro device to the circuit board is performed under vacuum, decompressed, a reducing atmosphere or an inert gas atmosphere so that the cavity portion configured by inner wall surfaces of the device substrate, the function element, the circuit board and the sealing resin layer is kept to be vacuum, decompressed, a reducing atmosphere or an inert gas atmosphere.

15. A method of producing a semiconductor device as set forth in claim 13, further comprising a step of flattening a formation surface of the second lands of the circuit board before the step of forming the uncured sealing resin layer on the second lands.

16. A method of producing a semiconductor device as set forth in claim 13, further comprising a step of flattening a formation surface of the second lands of the circuit board before the step of forming the uncured sealing resin layer on the second lands so that a level difference between the second lands and a part excepting the second lands becomes 10% or less of a film thickness of a sealing resin layer.

17. A method of producing a semiconductor device as set forth in claim 13, further comprising a step of forming solder ball bumps for circuit board on the other surface of the surface mounted with the micro device of the circuit board.

18. A method of producing a semiconductor device including mounting a micro device having a device substrate, a function element provided to a surface of the device substrate and having an oscillator or a movable part, and first lands provided to the surface of the device substrate by being arranged on an outer circumference portion of the function element to a circuit board having second lands formed to correspond to the first lands and bumps provided to the second lands, the method comprising the steps of:

forming an uncured sealing resin layer on the first lands so as to go round the outer circumference portion of the function element by including a first land formation region of the device substrate;

mounting the micro device on the circuit board from the first land formation surface side so that the bumps penetrate the sealing resin layer to contact and electrically connect to the first lands and the sealing resin layer seals a clearance between the device substrate and the circuit board; and

curing the sealing resin layer to fix connection portions of the bumps and the first lands.

19. A method of producing a semiconductor device as set forth in claim 18, wherein the step of mounting the micro device to the circuit board is performed under vacuum, decompressed, a reducing atmosphere or an inert gas atmosphere so that the cavity portion configured by inner wall surfaces of the device substrate, the function element, the circuit board and the sealing resin layer is kept to be vacuum, decompressed, a reducing atmosphere or an inert gas atmosphere.

20. A method of producing a semiconductor device as set forth in claim 18, further comprising a step of forming solder ball bumps for circuit board on the other surface of the surface mounted with the micro device of the circuit board.