RFID inlays and methods of their manufacture

• US 20070040686A1
• Filed: 08/16/2005
• Published: 02/22/2007
• Est. Priority Date: 08/16/2005
• Status: Abandoned Application

• Current Assignee: X-Cyte Inc.
• Original Assignee: X-Cyte Inc.
• Inventors: Reis, Antonio
• Application Number:
  US11/205,545
• Publication Number:
  US 20070040686A1
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95122 by applying vibration
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01016 Sulfur [S]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A method of manufacturing RFID inlay structures includes providing a strap substrate containing an RFID chip. Strap pad patterns are formed adjacent said recessed regions over contacts of the RFID chip using a directly electroplateable resin (DER). The strap substrate is attached to an inlay substrate having an electrically conductive antenna and antenna contact patterns. The DER strap pad patterns, antenna pattern, antenna contacts and chip contacts are electroplated, thereby forming a metal interconnect between the contacts of the RFID chip and the antenna contacts on the inlay substrate. The strap substrate may be obtained from a web of strap substrates formed by a casting process. The DER material may be in the form of a DER ink and applied using a pen-plotter apparatus to form strap pad patterns or antenna coil patterns on the strap substrate, and to form antenna features and antenna contact patterns on the inlay substrate.

Claims

1. A method of manufacturing an RFID inlay, comprising:

providing a strap substrate containing an RFID chip;

forming electrically conducting strap pad patterns that cover a portion of a first major surface of said strap substrate and electrical contacts of said RFID chip;

providing an inlay substrate having an electrically conductive antenna and antenna contact patterns; and

electroplating said strap pad patterns and said antenna contact patterns to form metal strap pads, metal antenna contacts, and a metal interconnect between said antenna contact patterns and said electrical contacts of said RFID chip.

2. The method of manufacturing an RFID inlay according to claim 1 wherein forming electrically conducting strap pad patterns comprises forming electrically conductive strap pad patterns from a directly electroplateable resin (DER).

3. The method of manufacturing an RFID inlay according to claim 2, further comprising coating one or more edges of the strap substrate with a DER.

4. The method of manufacturing an RFID inlay according to claim 2, further comprising forming the antenna contact patterns from DER.

5. The method of manufacturing an RFID inlay according to claim 2 wherein forming electrically conductive strap pad patterns from a DER comprises printing the DER on the strap substrate.

6. The method of manufacturing an RFID inlay according to claim 2 wherein forming electrically conductive strap pad patterns from a DER comprises applying the DER by a plotter pen apparatus.

7. The method of manufacturing an RFID inlay according to claim 1, further comprising assembling the RFID chip into a recessed region of the strap substrate prior to forming the DER strap pad patterns.

8. The method of manufacturing an RFID inlay according to claim 1 wherein providing a strap substrate comprises:

casting a web of strap substrates from a low viscosity material, said web including a plurality of recessed regions;

assembling a plurality of RFID chips into the plurality of recessed regions; and

cutting the web of strap substrates into a plurality of strap substrates to provide said strap substrate having a recessed region containing an RFID chip.

9. The method of manufacturing an RFID inlay according to claim 8 wherein assembling a plurality of RFID chips in the plurality of recessed regions is performed by a self-assembly process.

10. The method of manufacturing an RFID inlay according to claim 9 wherein the self-assembly process comprises a fluidic or vibration self-assembly process.

11. The method of manufacturing an RFID inlay according to claim 1 wherein the DER is formulated from a binder and a conductive powder.

12. The method of manufacturing an RFID inlay according to claim 11 wherein the DER has a microscopic electrical volume resistivity of less than about 1000 ohm-cm.

13. The method of manufacturing an RFID inlay according to claim 11 wherein the conductive powder has a mean particle size of less than about two microns.

14. The method of manufacturing an RFID inlay according to claim 1 wherein the metal strap pads and metal interconnect are formed during a single electroplating process.

15. The method of manufacturing an RFID inlay according to claim 1 wherein providing a strap substrate comprises:

providing a web of strap substrates, said web having a plurality of recessed regions; and

assembling a plurality of RFID chips into the plurality of recessed regions.

16. The method of manufacturing an RFID inlay according to claim 15, further comprising separating said web into a plurality of strips, each strip having a succession of strap substrates and corresponding RFID chips

17. The method of manufacturing an RFID inlay according to claim 16 wherein said strap pad patterns are formed prior to separating the web into a plurality of strips.

18. The method of manufacturing an RFID inlay according to claim 15 wherein assembling the plurality of RFID chips into the plurality of recessed regions is performed using a self-assembly process.

19. The method of manufacturing an RFID inlay according to claim 2, further comprising, prior to providing a strap substrate containing an RFID chip,

forming a recessed region in said strap substrate;

forming DER strap pad pattern extensions that extend into said recessed region; and

assembling the RFID chip into said recessed region so that the RFID chip contacts are in electrical connection with the strap pad pattern extensions.

20. A method of manufacturing strap substrates for an RFID inlay, comprising:

providing a substrate;

placing a plurality of RFID chips onto said substrate; and

forming strap pad patterns or antenna coil patterns of directly electroplateable resin (DER) on said substrate, at least one of said DER strap pad patterns or DER antenna coil patterns having a terminal that is in electrical contact with an electrical contact of an RFID chip of said plurality of RFID chips.

21. The method of manufacturing strap substrates for an RFID inlay according to claim 20 wherein placing the plurality of RFID chips onto said substrate comprises assembling said plurality of RFID chips into a plurality of recessed regions formed in said substrate.

22. The method of manufacturing strap substrates for an RFID inlay according to claim 21 wherein placing the plurality of RFID chips into said plurality of recessed regions is performed using a self-assembly process.

23. The method of manufacturing strap substrates for an RFID inlay according to claim 20 wherein said plurality of recessed regions are formed by:

introducing a low-viscosity curable material onto a casting apparatus having a plurality of casting patterns; and

curing said low-viscosity material to provide the substrate containing the plurality of recessed regions.

24. The method of manufacturing strap substrates for an RFID inlay according to claim 20 wherein forming the plurality of strap pad patterns or antenna coil patterns of DER on said substrate comprises printing the DER patterns.

25. The method of manufacturing strap substrates for an RFID inlay according to claim 20 wherein forming the plurality of strap pad patterns or antenna coil patterns of DER on said substrate comprises applying the DER by a plotter pen apparatus.

26. The method of manufacturing strap substrates for an RFID inlay according to claim 20, further comprising separating said substrate into a plurality of strips, each strip having a succession of strap substrates, and each strap substrate including DER strap pad patterns or a DER antenna coil pattern and a corresponding RFID chip.

27. The method of manufacturing strap substrates for an RFID inlay according to claim 26, further comprising rolling one or more of said plurality of strips onto a reel.

28. The method of manufacturing strap substrates for an RFID inlay according to claim 26, further comprising coating longitudinal edges of the strips with DER.

29. The method of manufacturing strap substrates for an RFID inlay according to claim 20 wherein the DER is formulated from a binder and a conductive powder.

30. The method of manufacturing strap substrates for an RFID inlay according to claim 29 wherein the DER has a microscopic electrical volume resistivity of less than about 1000 ohm-cm.

31. The method of manufacturing strap substrates for an RFID inlay according to claim 29 wherein the conductive powder has a mean particle size of less than about two microns.

32. The method of manufacturing strap substrates for an RFID inlay according to claim 21 wherein, forming the plurality of DER strap pad patterns or antenna coil patterns is performed prior to placing the plurality of RFID chips into said plurality of recessed regions, and forming said plurality of DER strap pad patterns further comprises forming a plurality of DER pattern extensions that extend said plurality of DER strap pad patterns or terminals of the DER antenna coil patterns into the bottoms of the plurality of recessed regions, said plurality of DER pattern extensions configured to electrically contact contacts of said plurality of RFID chips after the plurality of RFID chips are placed into the recessed regions.

33. An RFID inlay structure, comprising:

an inlay substrate having an antenna and antenna contacts;

a strap substrate carrying an RFID chip and having at least one surface coated with a directly electroplateable resin (DER), said DER being in electrical contact with said antenna contacts and contacts of said RFID chip; and

a metal interconnection electrically connected between the contacts of the RFID chip and the antenna contacts on the inlay substrate.

34. The RFID inlay structure according to claim 33 wherein the strap substrate has a first major surface with a recessed region configured to hold the RFID chip.

35. The RFID inlay structure according to claim 34 wherein the recessed region is a casted recessed region.

36. The RFID inlay structure according to claim 34 wherein the RFID chip contacts are oriented toward the bottom of the recessed region.

37. The RFID inlay structure according to claim 33 wherein at least one edge of said strap substrate is coated with DER.

38. The RFID inlay structure according to claim 34 wherein the DER coated surface extends into the recessed region and in electrical contact with the RFID chip contacts.

39. The RFID inlay structure according to claim 33 wherein said DER is formulated from a binder and a conductive powder.

40. The RFID inlay structure according to claim 39 wherein said conductive powder includes carbon black.

41. The RFID inlay structure according to claim 39 wherein the DER has a microscopic electrical volume resistivity of less than about 1000 ohm-cm.

42. The RFID inlay structure according to claim 39 wherein the conductive powder has a mean particle size of less than about two microns.

43. An RFID inlay structure, comprising:

a substrate;

an RFID chip disposed on said substrate; and

a pattern of directly electroplateable resin (DER) formed on said substrate and on one or more electrical contacts of said RFID chip.

44. The RFID inlay structure according to claim 43, further comprising:

a second substrate having an antenna formed thereon; and

a metal interconnect coupled between said one or more electrical contacts of said RFID chip and antenna contact positions of said antenna.

45. The RFID inlay structure according to claim 43 wherein said pattern comprises a loop antenna pattern.