Thermal management for a ruggedized electronics enclosure

• US 20070041160A1
• Filed: 08/19/2005
• Published: 02/22/2007
• Est. Priority Date: 08/19/2005
• Status: Abandoned Application

• Current Assignee: Computer Themis
• Original Assignee: Computer Themis
• Inventors: Smith, Dennis, Kehret, William
• Application Number:
  US11/207,672
• Publication Number:
  US 20070041160A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate rigidly coupled to a structural foam layer for providing mechanical support and thermal dissipation for the electronic components. A fluid channel, rigidly coupled to the structural foam, is provided for directing a cooling fluid in the plane of the heat spreader and a bottom plate rigidly coupled to the structural foam to protect the electronic components against one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention relates to a ruggedized electronics enclosure for housing electronic components containing a top compartment configured to house the electronic components. The top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly, rigidly coupled to the top compartment. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.

Claims

1. A ruggedized electronics enclosure for housing electronic components comprising:

a first electronics layer;

a second electronics layer electrically coupled and adjacent to said first electronics layer;

a heat spreader unit mechanically coupled to said second electronics layer by way of a structural support;

a thermal shunt configured to channel heat from said first and said second electronics layers to said heat spreader unit and to provide dissipation of mechanical shock generated by a destructive shock event; and

a ruggedized compartment configured to house said first electronics layer, said second electronics layer, said heat spreader unit, and said thermal shunt, the ruggedized compartment does not substantially deform in response to the destructive shock event.

2. The ruggedized electronics enclosure of claim 1 further comprising:

a first thermal interposer, housed within said ruggedized compartment, and positioned in between said first electronics layer and said second electronics layer, said first thermal interposer configured to conduct heat, in a first direction, generated by said first and said second electronics layers.

3. The ruggedized electronics enclosure of claim 2 wherein said thermal shunt is mechanically bored through said first and said second electronics layer.

4. The ruggedized electronics enclosure of claim 1 further comprising a plurality of thermal shunts configured to channel heat from said first and said second electronics layers to said heat spreader unit and to provide transfer of mechanical energy between layers.

5. The ruggedized electronics enclosure of claim 1 wherein said cooling assembly comprises a rigid truss plate cooling assembly.

6. The ruggedized electronics enclosure of claim 1 wherein said cooling assembly comprises a liquid cooling assembly.

7. A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:

a heat spreader unit;

a structural foam layer, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;

a fluid channel, rigidly coupled to said structural foam layer, for directing a cooling fluid in a first direction; and

a bottom plate rigidly coupled to said structural foam layer, wherein said heat spreader unit, said structural foam layer, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock event, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

8. The liquid cooling assembly of claim 7, wherein said structural foam layer further comprises a fluid channel groove.

9. The liquid cooling assembly of claim 7, wherein said fluid channel is adhered to said fluid channel groove by way of a thermally conductive epoxy.

10. The liquid cooling assembly of claim 7, wherein said structural foam layer is formed with a closed-cell foam.

11. The liquid cooling assembly of claim 7, wherein said structural foam layer is formed with a substantially non-compressible material that has a substantially high thermal conductivity

12. The liquid cooling assembly of claim 7, wherein said bottom plate is embedded with a reinforcing fiber to provide structural strength and stiffness for compressive and extension forces, to improve the normal mode mechanical performance of the truss structure.

13. A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:

a heat spreader unit;

a maze structure, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;

a fluid channel, rigidly coupled to said maze structure, for directing a cooling fluid in a first direction; and

a bottom plate rigidly coupled to said maze structure, wherein said heat spreader unit, said maze structure, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock event, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

14. The liquid cooling assembly of claim 13, wherein said maze structure further comprises a matrix of cells.

15. The liquid cooling assembly of claim 14, wherein said matrix of cells are fabricated from a high tensile strength, highly thermally conductive material.

16. The liquid cooling assembly of claim 14, wherein said matrix of cells is fabricated from aluminum, graphite, or any particular reinforced carbon fiber.