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Packaging of electronic chips with air-bridge structures

  • US 20070042595A1
  • Filed: 10/26/2006
  • Published: 02/22/2007
  • Est. Priority Date: 08/25/1999
  • Status: Abandoned Application
First Claim
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1. A method of forming an air bridge structure comprising:

  • forming a material layer on an electronic chip;

    embedding a conductive support structure and at least one conductive structure in the material layer, the at least one conducive structure including a horizontal interconnect path coupled to at least two vertical wirings coupled to the electronic chip; and

    removing the material layer.

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