Method of manufacturing wiring board
First Claim
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1. A method of manufacturing a wiring board, the method comprising:
- forming, on a supporting board, an insulating layer in which a semiconductor chip is embedded and a wiring being connected to the semiconductor chip;
removing the supporting board; and
forming a first reinforcing layer and a second reinforcing layer simultaneously so as to sandwich the insulating layer after removing the supporting board.
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Abstract
A method of manufacturing a wiring board including an insulating layer where a semiconductor chip is embedded includes: forming, on a supporting board, the insulating layer where the semiconductor chip is embedded and a wiring connected to the semiconductor chip; removing the supporting board by etching; and simultaneously forming first and second reinforcing layers so as to sandwich the insulating layer after removing the supporting board.
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Citations
5 Claims
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1. A method of manufacturing a wiring board, the method comprising:
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forming, on a supporting board, an insulating layer in which a semiconductor chip is embedded and a wiring being connected to the semiconductor chip;
removing the supporting board; and
forming a first reinforcing layer and a second reinforcing layer simultaneously so as to sandwich the insulating layer after removing the supporting board. - View Dependent Claims (2, 3, 4, 5)
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Specification