Package structure for an acceleration sensor

• US 20070044557A1
• Filed: 08/30/2005
• Published: 03/01/2007
• Est. Priority Date: 08/30/2005
• Status: Active Grant

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Inventors: Ooka, Fumihiko, Takemasa, Kengo
• Granted Patent: US 7,571,647 B2
• Time in Patent Office: Days
• US Class Current: 73/493
• CPC Class Codes: G01P 1/006 used for thermal compensation
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

According to the present invention, a package for an acceleration sensor, includes an acceleration sensor which is proved with a first terminal; a package base; an adhesive layer provided on the package base; and a spacer provided between the adhesive layer and the acceleration sensor. The spacer comprises a second terminal, which is electrically coupled to the first terminal of the acceleration sensor.

Claims

1. A package for an acceleration sensor, comprising:

an acceleration sensor which is proved with a first terminal;

a package base;

an adhesive layer provided on the package base; and

a spacer provided between the adhesive layer and the acceleration sensor, wherein

the spacer comprises a second terminal, which is electrically coupled to the first terminal of the acceleration sensor.

2. A package for an acceleration sensor according to claim 1, wherein

the package base is made of ceramics.

3. A package for an acceleration sensor according to claim 1, wherein

the adhesive layer is made of a resin having a low coefficient of elasticity, which is lower than 100 MPa.

4. A package for an acceleration sensor according to claim 1, wherein

the spacer is a semiconductor device having a wiring pattern thereon.

5. A package for an acceleration sensor according to claim 1, wherein

the spacer is a LSI chip having a functional circuit therein.

6. A package for an acceleration sensor according to claim 1, wherein

the acceleration sensor comprises a movable mass and a detecting element, which electrically detects a physical movement of the mass, and wherein

the detecting element is connected to the first terminal.

7. A package for an acceleration sensor according to claim 1, wherein

the first terminal is arranged at a side facing the spacer.

8. A package for an acceleration sensor according to claim 6, wherein

the detecting element and the first terminal are arranged at a side facing the spacer.

9. A package for an acceleration sensor according to claim 6, wherein

the detecting element is a piezoresistances to which a stress is applied in response to movement of the movable mass, in which variation of stress is detected as a variation of resistance.

10. A package for an acceleration sensor according to claim 1, further comprising:

an external terminal, which is electrically coupled to the second terminal of the spacer and to an external circuit.

11. A package for an acceleration sensor according to claim 10, wherein

the external terminal and the second terminal of the spacer are wire-bonded to each other in the package.

12. A package for an acceleration sensor according to claim 1, further comprising:

a conductive bump, which electrically connect the first terminal of the acceleration sensor and the second terminal of the spacer.

13. A package for an acceleration sensor according to claim 12, wherein

the package base is made of ceramics.

14. A package for an acceleration sensor according to claim 12, wherein

the adhesive layer is made of a resin having a low coefficient of elasticity, which is lower than 100 MPa.

15. A package for an acceleration sensor according to claim 12, wherein

the spacer is a semiconductor device having a wiring pattern thereon.

16. A package for an acceleration sensor according to claim 12, wherein

the spacer is a LSI chip having a functional circuit therein.

17. A package for an acceleration sensor according to claim 12, wherein

the acceleration sensor comprises a movable mass and a detecting element, which electrically detects a physical movement of the mass, and wherein

the detecting element is connected to the first terminal.

18. A package for an acceleration sensor according to claim 12, wherein

the first terminal is arranged at a side facing the spacer.

19. A package for an acceleration sensor according to claim 17, wherein

the detecting element and the first terminal are arranged at a side facing the spacer.

20. A package for an acceleration sensor according to claim 17, wherein

the detecting element is a piezoresistances to which a stress is applied in response to movement of the movable mass, in which variation of stress is detected as a variation of resistance.

21. A package for an acceleration sensor according to claim 12, further comprising:

an external terminal, which is electrically coupled to the second terminal of the spacer and to an external circuit.

22. A package for an acceleration sensor according to claim 21, wherein

the external terminal and the second terminal of the spacer are wire-bonded to each other in the package.