Dynamic voltage and power management by temperature monitoring
First Claim
1. A supply voltage management system for an integrated circuit die, comprising:
- one or more temperature sensing elements located on the die and configured to sense temperature of the die and to output a sensed temperature value; and
a dynamic voltage controller located on the die, configured to receive the sensed temperature value and to identify a technology process category of the die, and based on the sensed temperature value and the identified technology process category of the die, adjust a supply voltage to at least one circuit of the die.
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Accused Products
Abstract
A supply voltage management system and method for an integrated circuit (IC) die are provided. The supply voltage management system includes one or more temperature sensing elements located on the IC die and configured to sense temperature of the die and to output a sensed temperature value for the die. A dynamic voltage controller is located on the die and is configured to receive the sensed temperature value for the die and to identify a technology process category of the die. Based on the sensed temperature value and the identified technology process category of the die, the dynamic voltage controller adjusts an output voltage to at least one circuit of the die.
29 Citations
17 Claims
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1. A supply voltage management system for an integrated circuit die, comprising:
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one or more temperature sensing elements located on the die and configured to sense temperature of the die and to output a sensed temperature value; and
a dynamic voltage controller located on the die, configured to receive the sensed temperature value and to identify a technology process category of the die, and based on the sensed temperature value and the identified technology process category of the die, adjust a supply voltage to at least one circuit of the die. - View Dependent Claims (2, 3)
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4. A supply voltage management system for an integrated circuit die, comprising:
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a plurality of voltage islands located on the die, each of the plurality of voltage islands comprising at least one circuit requiring a supply voltage associated with the respective voltage island and at least one temperature sensing element configured to sense temperature of the respective voltage island and output a sensed temperature value associated with the respective voltage island; and
a dynamic voltage controller located on the die and configured to receive the sensed temperature value associated with the respective voltage island, and to identify a technology process category of the die, wherein the dynamic voltage controller adjusts the supply voltage to the respective voltage island based on at least the sensed temperature value and the technology process category of the die. - View Dependent Claims (5, 6, 7, 8)
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9. A method for adjusting an output voltage to at least one circuit of an integrated circuit die, comprising:
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sensing a temperature of the die and outputting a sensed temperature value of the die;
receiving the sensed temperature value of the die;
accessing data stored in memory to identify a technology process category of the die; and
adjusting the output voltage to the at least one circuit of the integrated circuit die based on at least the sensed temperature value and the technology process category of the die. - View Dependent Claims (10, 11)
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12. A method for adjusting an output voltage to at least one circuit for each of a plurality of voltage islands of an integrated circuit die, comprising:
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sensing temperature for each of the plurality of voltage islands and outputting a sensed temperature value of the respective voltage island;
receiving the sensed temperature value of the respective voltage island;
accessing data stored in memory to identify a technology process category of the die; and
adjusting the output voltage to the at least one circuit for each of the plurality of voltage islands based on at least the sensed temperature value and the technology process category of the die. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification