Method for forming a double embossing structure
First Claim
1. A method for fabricating a circuitry component, comprising depositing a first metal layer over a substrate;
- forming a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposing said first metal layer;
depositing a second metal layer over said first metal layer exposed by said first opening;
removing said first pattern-defining layer;
forming a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposing said second metal layer;
depositing a third metal layer over said second metal layer exposed by said second opening;
removing said second pattern-defining layer;
after said removing said second pattern-defining layer, removing said first metal layer not under said second metal layer; and
after said removing said first metal layer, forming a polymer layer over said second metal layer, wherein said third metal layer is used as a metal bump bonded to an external circuitry.
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Accused Products
Abstract
A method for fabricating a circuitry component comprises depositing a first metal layer over a substrate; forming a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposing said first metal layer; depositing a second metal layer over said first metal layer exposed by said first opening; removing said first pattern-defining layer; forming a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposing said second metal layer; depositing a third metal layer over said second metal layer exposed by said second opening; removing said second pattern-defining layer; removing said first metal layer not under said second metal layer; and forming a polymer layer over said second metal layer, wherein said third metal layer is used as a metal bump bonded to an external circuitry.
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Citations
20 Claims
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1. A method for fabricating a circuitry component, comprising
depositing a first metal layer over a substrate; -
forming a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposing said first metal layer;
depositing a second metal layer over said first metal layer exposed by said first opening;
removing said first pattern-defining layer;
forming a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposing said second metal layer;
depositing a third metal layer over said second metal layer exposed by said second opening;
removing said second pattern-defining layer;
after said removing said second pattern-defining layer, removing said first metal layer not under said second metal layer; and
after said removing said first metal layer, forming a polymer layer over said second metal layer, wherein said third metal layer is used as a metal bump bonded to an external circuitry. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for fabricating a circuitry component, comprising
depositing a first metal layer over a substrate; -
forming a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposing said first metal layer;
depositing a second metal layer over said first metal layer exposed by said first opening;
removing said first pattern-defining layer;
forming a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposing said second metal layer;
depositing a third metal layer over said second metal layer exposed by said second opening; and
removing said second pattern-defining layer, wherein said third metal layer is used to be wirebonded thereto. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method for fabricating a circuitry component, comprising
depositing a first metal layer over a substrate; -
forming a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposing said first metal layer;
depositing a second metal layer over said first metal layer exposed by said first opening;
removing said first pattern-defining layer;
forming a polymer layer over said second metal layer and part of said first metal layer; and
removing said first metal layer not under said second metal layer and not under said polymer layer. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification