LSI PACKAGE PROVIDED WITH INTERFACE MODULE

• US 20070045868A1
• Filed: 10/24/2006
• Published: 03/01/2007
• Est. Priority Date: 12/26/2003
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Hamasaki, Hiroshi, FURUYAMA, HIDETO
• Granted Patent: US 7,759,781 B2
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/10704 Pin grid array [PGA]
• CPC Class Codes: H05K 2201/10719 Land grid array [LGA]
• CPC Class Codes: H05K 7/023 Stackable modules

Abstract

A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.

Claims

1. An interposer included in an LSI package, the LSI package further including a signal processing LSI mounted on the interposer and an interface module having a transmission line configured to establish an external interconnection of signal, which is transmitted through the interposer, the interposer comprising:

a plurality of module-connecting terminals configured to mechanically and electrically connect with a plurality of interposer-connecting terminals provided on the interface module, part of the module-connecting terminals are assigned as monitoring terminals, through which a monitoring current to confirm electrical connection between the module-connecting terminals and the interposer-connecting terminals flows.

2. The interposer of claim 1, wherein at least one pair of the module-connecting terminals are mutually short-circuited as first monitoring terminals serving as elements of a monitoring circuit, which monitors the electrical connection between the signal processing LSI and the interface module.

3. The interposer of claim 1, wherein a plurality of separated areas are provided, the first monitoring terminals are disposed in each of the separated areas, so as to provide a plurality of monitoring circuits.

12. The signal processing LSI of claim 2, further comprising an input/output controller configured to control transmission and reception of signals to and from the interface module, by blocking the signals when poor connection is detected in the current path.

4. An interface module included in an LSI package, the LSI package further including a signal processing LSI and an interposer mounting the signal processing LSI, the interface module having a transmission line configured to establish an external interconnection of signal, which is transmitted through the interposer, the interface module comprising:

a plurality of interposer-connecting terminals configured to mechanically and electrically connect with a plurality of module-connecting terminals provided on the interposer, part of the interposer-connecting terminals are assigned as monitoring terminals, through which a monitoring current to confirm electrical connection between the signal processing LSI and the interface module flows.

5. The interface module of claim 4, further comprising a circuit configured to block transmission and reception of signals to and from external interconnection when poor connection is detected between the interposer-connecting terminals and the module-connecting terminals.

6. The interface module of claim 4, wherein at least one pair of the interposer-connecting terminals are mutually short-circuited as the second monitoring terminals serving as elements of a monitoring circuit, which monitors the electrical connection between the signal processing LSI and the interface module.

7. The interface module of claim 5, wherein a plurality of separated areas are assigned on the interface module, the monitoring terminals are disposed respectively in the separated areas, so as to provide a plurality of monitoring circuits.

8. A monitoring circuit of an LSI package including a signal processing LSI, an interposer mounting the signal processing LSI and an interface module having a transmission line configured to establish an external interconnection of signal, which is transmitted through the interposer, configured to monitor electrical connection between the signal processing LSI and the interface module, the monitoring circuit comprising:

a conduction confirmation circuit configured to confirm the electrical connection by providing a first status signal when resistance in a current path from the signal processing LSI, through the interposer, to the interface module is smaller than a predetermined value, and a second status signal when the resistance is larger than the predetermined value.

9. The monitoring circuit of claim 8, wherein the resistance includes a resistance of a current path from a first interposer-site monitoring terminal, a first module-site monitoring terminal configured to be connected with the first interposer-site monitoring terminal, a short-circuit path connected with the first module-site monitoring terminal in the interface module, a second module-site monitoring terminal connected with the short-circuit path in the interface module and a second interposer-site monitoring terminal configured to be connected with the second module-site monitoring terminal.

10. A monitoring circuit of an LSI package including a signal processing LSI, an interposer mounting the signal processing LSI and an interface module having a transmission line configured to establish external interconnection of a signal, which is transmitted through the interposer, configured to confirm electrical connection between the signal processing LSI and the interface module, the monitoring circuit comprising:

a conduction confirmation circuit configured to confirm the electrical connection by providing a first status signal when a monitoring pulse provided by the signal processing LSI is returned through a current path from the signal processing LSI, through the interposer, to the interface module and a second status signal when the monitoring pulse is not returned from the current path.

11. A signal processing LSI to be included in an LSI package, the LSI package further including an interposer mounting the signal processing LSI, an interface module having a transmission line configured to establish an external interconnection of signal, which is transmitted through the interposer, and a monitoring circuit configured to monitor electrical connection between the signal processing LSI and the interface module, the signal processing LSI comprising:

a conduction confirmation circuit configured to confirm the electrical connection by providing a first status signal when the electrical connection in a current path from the signal processing LSI, through the interposer, to the interface module is normal, and a second status signal when the electrical connection is abnormal.