High power, low noise interconnection for an integrated dual wound motor to a dual inverter

• US 20070046223A1
• Filed: 09/01/2005
• Published: 03/01/2007
• Est. Priority Date: 09/01/2005
• Status: Active Grant

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations Incorporated (Motors Liquidation Co. GUC Trust)
• Inventors: Selogie, Mark, Stancu, Constantin, Korich, Mark
• Granted Patent: US 7,449,853 B2
• Time in Patent Office: Days
• US Class Current: 318/400.210
• CPC Class Codes: H02K 3/50 Fastening of winding heads, equalising connectors, or connections thereto
• CPC Class Codes: H02K 5/225 Terminal boxes or connection arrangements specially adapted for submersible motors H02K5/132
• CPC Class Codes: H02K 9/223 Heat bridges
• CPC Class Codes: H02K 9/227 Heat sinks
• CPC Class Codes: H02M 1/44 Circuits or arrangements for compensating for electromagnetic interference in converters or inverters

Abstract

A high current interconnection system is provided which can be configured to couple a motor to an inverter. A high current interconnection system comprises a bus bar, a motor winding coupled to the bus bar, and a thermal interface. The motor winding is configured to receive a current. The thermal interface can be coupled to at least one of the motor winding or the bus bar. The thermal interface is configured to reduce a temperature of the motor winding or bus bar which the thermal interface is coupled to.

Claims

1. A high current interconnection system configured to couple a motor to an inverter assembly comprising at least one inverter module, comprising:

a bus bar located outside the at least one inverter module and inside the inverter assembly; and

at least one thermal interface being directly coupled to the bus bar outside the at least one inverter module, the thermal interface being configured to reduce a temperature of the bus bar which the thermal interface is coupled to, wherein the thermal interface comprises;

a heat clamp comprising a thermally conductive material, the heat clamp being coupled to the bus bar outside the at least one inverter module; and

a heat sink portion, coupled to the heat clamp, being configured to reduce the temperature of the bus bar.

2. The system of claim 1, further comprising:

a sensor, coupled directly to the bus bar, configured to sense the current.

3. The system of claim 2, wherein the bus bar is configured to be coupled to the at least one inverter module.

6. The system of claim 1, wherein the thermal interface is coupled to the bus bar.

10. The system of claim 1, wherein the heat sink portion comprises a liquid cooled heat sink.

4. (canceled)

5. (canceled)

7. (canceled)

8. (canceled)

9. (canceled)

11. A high current interconnection system configured to couple a motor to an inverter assembly comprising a plurality of inverter modules each comprising a plurality of inverter sub-modules, comprising:

a plurality of bus bars located outside the plurality of inverter sub-modules and inside the inverter assembly, wherein each of the bus bars is coupled to a corresponding one of the sub-modules and directly receives a current from the corresponding one of the sub-modules the bus bar is coupled to; and

at least one thermal interface being directly coupled to at least one of the bus bars outside the plurality of inverter sub-modules, the thermal interface being configured to reduce a temperature of the at least one bus bar the thermal interface is coupled to, wherein the thermal interface comprises;

a heat clamp comprising a thermally conductive material, the heat clamp being coupled to the at least one bus bar outside the plurality of inverter sub-modules; and

a heat sink portion, coupled to the heat clamp, being configured to reduce the temperature of the at least one bus bar.

12. The system of claim 11, further comprising:

a plurality of sensors, coupled directly to at least some of the bus bars, wherein each sensor is configured to sense the current flowing in the bus par it is coupled to.

16. The system of claim 11, wherein the at least one thermal interface is coupled to at least one of the bus bars.

18. The system of claim 11, further comprising:

a plurality of other thermal interfaces, wherein each of the other thermal interfaces is coupled to at least one of the bus bars, wherein each of the other thermal interfaces is configured to reduce a temperature of the at least one bus bar the other thermal interface is coupled to.

20. The system of claim 11, wherein the heat sink portion comprises a liquid cooled heat sink.

13. (canceled)

14. (canceled)

15. (canceled)

17. (canceled)

19. (canceled)