Energy pathway arrangements for energy conditioning

• US 20070047177A1
• Filed: 07/17/2006
• Published: 03/01/2007
• Est. Priority Date: 10/17/2000
• Status: Active Grant

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, William
• Granted Patent: US 7,428,134 B2
• Time in Patent Office: Days
• US Class Current: 361/321.200
• CPC Class Codes: H05K 9/0052 Shielding other than Faraday cages

Abstract

The system of an energy conditioner comprising: a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer; wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer; wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another; a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer; and a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer

Claims

1-25. -25. (canceled)

26. An energy conditioner comprising:

a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer;

wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer;

wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another;

a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer;

a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer;

wherein each one of said first conductive shield layer, said second conductive shield layer, said third conductive shield layer, said first pair of conductive non-shield layers, and said second pair of conductive non-shield layers extends in a first dimension and a second dimension; and

wherein said first pair first layer consists of a first pair first layer overlap region and at least one first pair first layer non-overlap region;

wherein said first pair second layer consists of a first pair second layer overlap region and at least one first pair second layer non-overlap region;

wherein said first pair first layer and said first pair second layer are stacked so that said first pair first layer overlap region and said first pair second layer overlap region overlap one another, thereby defining a first pair overlap region;

wherein said second pair first layer consists of a second pair first layer overlap region and at least one second pair first layer non-overlap region;

wherein said second pair second layer consists of a second pair second layer overlap region and at least one second pair second layer non-overlap region;

wherein said second pair first layer and said second pair second layer are stacked so that said second pair first layer overlap region and said second pair second layer overlap region overlap one another, thereby defining a second pair overlap region;

wherein none of said at least one first pair first layer non-overlap region, said at least one first pair second layer non-overlap region, said at least one second pair first layer non-overlap region, and said at least one second pair second layer non-overlap region overlap one another;

wherein said first conductive shield layer is above all layers of said first pair and said second pair;

wherein said second conductive shield layer is between said first pair first layer and said first pair second layer, and said second conductive shield layer is between said second pair first layer and said second pair second layer;

wherein said third conductive shield layer is below all layers of said first pair and said second pair;

wherein said first conductive shield layer, said second conductive shield layer, said third conductive shield layer all extend in said first dimension and said second dimension beyond the extend in said first dimension and said second dimension of said first pair overlap region; and

wherein said first conductive shield layer, said second conductive shield layer, said third conductive shield layer all extend in said first dimension and said second dimension beyond the extend in said first dimension and said second dimension of said second pair overlap region.

27. The conditioner of claim 26 wherein said first pair first layer and said second pair first layer reside in different planes.

28. The conditioner of claim 26 wherein said first pair first layer and said second pair first layer reside in the same plane.

29. The conditioner of claim 26 further comprising a third pair of conductive non-shield layers comprising a third pair first layer and a third pair second layer;

wherein said third pair first layer and said first pair first layer reside in different planes.

30. The conditioner of claim 26 wherein said conductive shield structure further comprises conductive connection material extending in a third dimension, wherein said third dimension is perpendicular to said first dimension, and wherein said conductive connection material conductively connects to one another said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer.

31. The conditioner of claim 30 wherein said conductive connection material includes conductive bands connecting to edges of said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer.

32. The conditioner of claim 30 wherein said conductive connection material includes conductive material extending through via holes.

33. The conditioner of claim 26 wherein said first conductive shield layer has a rectangular shape in said first dimension and said second dimension.

34. The conditioner of claim 26 wherein said first conductive shield layer has an annular shape in said first dimension and said second dimension.

35. The conditioner of claim 26 further comprising a dielectric material interspersed between conductive layers.

36. The conditioner of claim 26 wherein said conductive shield structure further comprises a fourth conductive shield layer above all other conductive layers of said conditioner and a fifth conductive shield structure below all other conductive layers of said conditioner.

37. The conditioner of claim 26 wherein said first pair first layer is above all other conductive layers in said conditioner.

38. The conditioner of claim 26 wherein said conductive shield structure consists of an odd number of conductive shield layers.

39. The conditioner of claim 26 wherein said at least one first pair first layer non-overlap region and said at least one first pair second layer non-overlap region each consist of one region.

40. The conditioner of claim 26 wherein said at least one first pair first layer non-overlap region and said at least one first pair second layer non-overlap region each consist of two discontinuous regions.

41. A circuit comprising the conditioner of claim 39 comprising a source of electrical power and a load, and wherein said conditioner has said first pair first layer connecting to a first path from said source to said load, and said first pair second layer connecting to a second path from said load to said source.

42. A circuit comprising the conditioner of claim 40 comprising a source of electrical power and a load, and wherein said conditioner has said first pair first layer connected in series with a first path from said source to said load.

43. The circuit of claim 42 wherein said conditioner has said first pair second layer connected in series with a second path from said load to said source.

44. The conditioner of claim 26 further comprising an additional conductive layer closely spaced to one of said first pair first layer, said first pair second layer, said second pair first layer, and said second pair second layer, and conductively coupled to the closely spaced conductive layer to form therewith a split electrode.

45. A voltage divider circuit comprising the conditioner of claim 26.

46. An amplifier circuit comprising the conditioner of claim 26.

47. The conditioner of claim 26 further comprising at least five electrode terminals that are electrically isolated from one another in said conditioner.

48. The conditioner of claim 26 further comprising at least seven electrode terminals that are electrically isolated from one another in said conditioner.

49. A method of making an energy conditioner comprising:

providing a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer;

wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer;

wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another;

providing a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer;

providing a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer;

wherein each one of said first conductive shield layer, said second conductive shield layer, said third conductive shield layer, said first pair of conductive non-shield layers, and said second pair of conductive non-shield layers extends in a first dimension and a second dimension; and

wherein said first pair first layer consists of a first pair first layer overlap region and at least one first pair first layer non-overlap region;

wherein said first pair second layer consists of a first pair second layer overlap region and at least one first pair second layer non-overlap region;

wherein said first pair first layer and said first pair second layer are stacked so that said first pair first layer overlap region and said first pair second layer overlap region overlap one another, thereby defining a first pair overlap region;

wherein said second pair first layer consists of a second pair first layer overlap region and at least one second pair first layer non-overlap region;

wherein said second pair second layer consists of a second pair second layer overlap region and at least one second pair second layer non-overlap region;

wherein said second pair first layer and said second pair second layer are stacked so that said second pair first layer overlap region and said second pair second layer overlap region overlap one another, thereby defining a second pair overlap region;

wherein none of said at least one first pair first layer non-overlap region, said at least one first pair second layer non-overlap region, said at least one second pair first layer non-overlap region, and said at least one second pair second layer non-overlap region overlap one another;

wherein said first conductive shield layer is above all layers of said first pair and said second pair;

wherein said second conductive shield layer is between said first pair first layer and said first pair second layer, and said second conductive shield layer is between said second pair first layer and said second pair second layer;

wherein said third conductive shield layer is below all layers of said first pair and said second pair;

wherein said first conductive shield layer, said second conductive shield layer, said third conductive shield layer all extend in said first dimension and said second dimension beyond the extend in said first dimension and said second dimension of said first pair overlap region; and

wherein said first conductive shield layer, said second conductive shield layer, said third conductive shield layer all extend in said first dimension and said second dimension beyond the extend in said first dimension and said second dimension of said second pair overlap region.

50. A method of using an energy conditioner, said energy conditioner comprising:

a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer;

wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer;

wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another;

a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer;

a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer;

wherein each one of said first conductive shield layer, said second conductive shield layer, said third conductive shield layer, said first pair of conductive non-shield layers, and said second pair of conductive non-shield layers extends in a first dimension and a second dimension; and

wherein said first pair first layer consists of a first pair first layer overlap region and at least one first pair first layer non-overlap region;

wherein said first pair second layer consists of a first pair second layer overlap region and at least one first pair second layer non-overlap region;

wherein said first pair first layer and said first pair second layer are stacked so that said first pair first layer overlap region and said first pair second layer overlap region overlap one another, thereby defining a first pair overlap region;

wherein said second pair first layer consists of a second pair first layer overlap region and at least one second pair first layer non-overlap region;

wherein said second pair second layer consists of a second pair second layer overlap region and at least one second pair second layer non-overlap region;

wherein said second pair first layer and said second pair second layer are stacked so that said second pair first layer overlap region and said second pair second layer overlap region overlap one another, thereby defining a second pair overlap region;

wherein none of said at least one first pair first layer non-overlap region, said at least one first pair second layer non-overlap region, said at least one second pair first layer non-overlap region, and said at least one second pair second layer non-overlap region overlap one another;

wherein said first conductive shield layer is above all layers of said first pair and said second pair;

wherein said second conductive shield layer is between said first pair first layer and said first pair second layer, and said second conductive shield layer is between said second pair first layer and said second pair second layer;

wherein said third conductive shield layer is below all layers of said first pair and said second pair;

wherein said first conductive shield layer, said second conductive shield layer, said third conductive shield layer all extend in said first dimension and said second dimension beyond the extend in said first dimension and said second dimension of said first pair overlap region;

wherein said first conductive shield layer, said second conductive shield layer, said third conductive shield layer all extend in said first dimension and said second dimension beyond the extend in said first dimension and said second dimension of said second pair overlap region; and

said method comprising applying a voltage to said first pair first electrode.