Heat transfer plate

• US 20070047209A1
• Filed: 09/01/2005
• Published: 03/01/2007
• Est. Priority Date: 09/01/2005
• Status: Active Grant

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations Incorporated (Motors Liquidation Co. GUC Trust)
• Inventors: Thompson, Alex, Ward, Terence
• Granted Patent: US 7,646,608 B2
• Time in Patent Office: Days
• US Class Current: 361/710
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01067 Holmium [Ho]
• CPC Class Codes: H01L 2924/01072 Hafnium [Hf]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H05K 7/20472 Sheet interfaces

Abstract

An apparatus for coupling a heat-generating device to a heat-removing device. The apparatus includes a thermally-conductive plate having a first side and a second side. The apparatus also includes a plurality of first channels that intersect with a plurality of second channels formed on at least one of the first side and the second side. The formation of the first channels and the second channels weaken the thermally-conductive plate. The apparatus further includes a plurality of protrusions formed by the intersection of the first channels and the second channels. The protrusions are deformable by coupling the thermally-conductive plate between the heat-generating device and the heat-removing device.

Claims

1. An apparatus for coupling a heat-generating device to a heat-removing device comprising:

a thermally-conductive plate having a first side and a second side;

a plurality of first channels that intersect with a plurality of second channels formed on at least one of said first side and said second side, wherein said formation of said first channels and said second channels weaken said thermally-conductive plate; and

a plurality of protrusions formed by said intersection of said first channels and said second channels, said protrusions are deformable by coupling said thermally-conductive plate between the heat-generating device and the heat-removing device.

2. The apparatus of claim 1 wherein each of said protrusions include a face having a surface area that abuts one of the heat-generating device and the heat-removing device, at least one said faces increasing said surface area when compressed between the heat-generating device and the heat-removing device.

3. The apparatus of claim 1 wherein each of said protrusions has a dimension defining a height, at least one said faces decreasing said height when compressed between the heat-generating device and the heat-removing device.

4. The apparatus of claim 1 wherein said thermally-conductive plate is electrically insulated.

5. The apparatus of claim 4 wherein said thermally-conductive plate is at least partially coated with parylene.

6. The apparatus of claim 1 wherein said thermally-conductive plate is made of copper.

7. The apparatus of claim 1 wherein said thermally-conductive plate has a dimension defining a thickness and said dimension is about 0.003 inches (about 0.076 millimeters).

8. The apparatus of claim 1 wherein said channels have a dimension defining a width, said dimension is about 0.003 inches (about 0.076 millimeters).

9. The apparatus of claim 1 wherein a width of said channels is about equal to a thickness of said thermally-conductive plate.

10. A thermally conductive medium for connecting a heat sink to an electronic device comprising:

a conformable plate;

a plurality of at least two of dimples, apertures, channels, valleys and protrusions formed in said conformable plate; and

a contact area increasing in size when compressed, said contact area including said at least two of dimples, apertures, channels, valleys and protrusions.

11. The thermally conductive medium of claim 10 wherein said conformable plate is electrically insulated.

12. The thermally conductive medium of claim 11 wherein said conformable plate is at least partially coated with parylene.

13. The thermally conductive medium of claim 10 wherein said conformable plate is made of copper.

14. The thermally conductive medium of claim 10 wherein a width of said channels is about equal to a thickness of said conformable plate.

16. A method for assembling a thermally conductive conformable plate between a heat-removing device and a heat-generating device comprising:

providing a conformable plate having at least one of dimples, apertures, channels, valleys and protrusions formed in said conformable plate; and

compressing the thermally conductive conformable plate between a first object and a second object, wherein said compressing of the thermally conductive conformable plate increases the surface area at which the conformable plate abuts at least one of a first surface on said first object and a second surface on said second object.

17. A method of forming a thermally conductive conformable plate comprising:

providing a conformable plate made of a thermally conductive material; and

forming at least one of dimples, apertures, channels, valleys and protrusions, wherein said at least one of dimples, apertures, channels, valleys and protrusions weaken said conformable plate.

18. The method of claim 17 further comprising removing material from said conformable plate to form said at least one of dimples, apertures, channels, valleys and protrusions.

19. The method of claim 17 further comprising pressing a structure into said conformable plate to form said at least one of dimples, apertures, channels, valleys and protrusions.

20. The method of claim 17 further comprising at least partially coating said conformable plate with parylene.

21. The method of claim 17 further comprising forming said protrusions from intersections of one of said channels and said valleys.