MEMS devices having support structures and methods of fabricating the same
First Claim
1. A method of fabricating a MEMS device, comprising:
- providing a substrate;
depositing an electrode layer over the substrate;
depositing a sacrificial layer over the electrode layer;
patterning the sacrificial layer to form apertures;
forming support structures over the sacrificial layer, wherein the support structures are formed at least partially within the apertures in the sacrificial material and wherein the support structures comprise a substantially horizontal wing portion extending over a substantially flat portion of the sacrificial material; and
depositing a movable layer over the sacrificial layer and the support structures.
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Accused Products
Abstract
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.
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Citations
65 Claims
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1. A method of fabricating a MEMS device, comprising:
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providing a substrate;
depositing an electrode layer over the substrate;
depositing a sacrificial layer over the electrode layer;
patterning the sacrificial layer to form apertures;
forming support structures over the sacrificial layer, wherein the support structures are formed at least partially within the apertures in the sacrificial material and wherein the support structures comprise a substantially horizontal wing portion extending over a substantially flat portion of the sacrificial material; and
depositing a movable layer over the sacrificial layer and the support structures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A MEMS device, comprising:
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a substrate;
an electrode layer located over the substrate;
a movable layer located over the electrode layer, wherein the movable layer is generally spaced apart from the electrode layer by a gap; and
support structures underlying at least a portion of the movable layer, wherein the support structures comprise a substantially horizontal wing portion, said substantially horizontal wing portion being spaced apart from the electrode layer by the gap. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. A MEMS device, comprising:
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first means for electrically conducting;
second means for electrically conducting; and
means for supporting said second conducting means over said first conducting means, wherein said second conducting means overlie the supporting means, and wherein said second conducting means is movable relative to said first conducting means in response to generating electrostatic potential between said first and second conducting means, wherein said supporting means comprise a substantially horizontal wing portion spaced apart from said first conducting means. - View Dependent Claims (63, 64, 65)
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Specification