Vacuum shroud for a die attach tool

• US 20070048120A1
• Filed: 08/15/2005
• Published: 03/01/2007
• Est. Priority Date: 08/15/2005
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Merritt, Sally, Costen, Nicholas
• Application Number:
  US11/203,894
• Publication Number:
  US 20070048120A1
• Time in Patent Office: Days
• US Class Current: 414/749.100
• CPC Class Codes: B65G 2249/02 Controlled or contamination-free environments or clean space conditions
• CPC Class Codes: B65G 2249/045 Details of suction cups suction cups
• CPC Class Codes: B65G 47/91 incorporating pneumatic, e.g. suction, grippers
• CPC Class Codes: B65G 49/061 Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames suction means as load-engaging elements attached to the lifting or lowering gear of cranes B66C1/02; suction cups for attaching purposes F16B47/00; suction cups on gripping heads B25J15/0616; suction cups in general B65G47/91; suction cups combined with cutting means on vertical conveyors C03B33/00 - C03B33/10; devices for turning sheets B65G49/067; suspending devices B65G49/066

Abstract

According to one embodiment of the invention, a system for die attach includes a wafer disposed outwardly from a carrier tape, the wafer having a plurality of die associated therewith, a pick head operable to, via a vacuum, pick up a die to be processed, and a shroud surrounding the pick head. A vacuum exhaust may be coupled to a sidewall of the shroud to redirect air leakage within the shroud generated by a bond force pressure chamber away from a top surface of the die to be processed and out of the shroud.

Claims

1. A system for die attach, comprising:

a wafer disposed outwardly from a carrier tape, the wafer having a plurality of die associated therewith;

a pick head operable to, via a vacuum, pick up a die to be processed; and

a shroud surrounding the pick head.

2. The system of claim 1, wherein the shroud comprises a cylindrical shroud.

3. The system of claim 1, further comprising a vacuum exhaust coupled to a sidewall of the shroud and operable to redirect air leakage from a bond force pressure chamber within the shroud.

4. The system of claim 3, wherein the vacuum exhaust is located such that the vacuum exhaust is above the die to be processed.

5. The system of claim 1, further comprising a vacuum exhaust coupled to a sidewall of the shroud and operable to redirect air leakage from a bond force pressure chamber within the shroud away from a top surface of the die to be processed and out of the shroud.

6. The system of claim 1, wherein the pick head is associated with a rotary die attach tool.

7. The system of claim 6, further comprising a base configured to couple the shroud to the rotary die attach tool.

8. The system of claim 1, further comprising a collet coupled to the pick head and wherein the shroud comprises a length sufficient to extend no further than a top of the collet when the die is being processed.

9. The system of claim 1, wherein the shroud is formed from aluminum.

10. A method of die attach, comprising:

providing a wafer having a plurality of die associated therewith;

picking up a die to be processed with a pick head via a vacuum;

surrounding the pick head with a shroud; and

redirecting air leakage generated from a bond force pressure chamber within the shroud.

11. The method of claim 10, wherein redirecting air leakage within the shroud comprises redirecting air leakage within the shroud away from a top surface of the die to be processed.

12. The method of claim 10, wherein redirecting air leakage within the shroud comprises redirecting air leakage within the shroud out through a vacuum exhaust coupled to a sidewall of the shroud.

13. The method of claim 12, wherein the vacuum exhaust is located such that the vacuum exhaust is above the die to be processed.

14. The method of claim 10, wherein the pick head is associated with a rotary die attach tool.

15. The method of claim 14, further comprising coupling the shroud to the rotary die attach tool.

16. The method of claim 10, further comprising causing the shroud to have a length sufficient to extend no further than a top of a collet associated with the pick head when the die is being processed.

17. A system for die attach in a clean room, comprising:

a die attach tool having a pick head;

a wafer disposed below the pick head, the wafer having a plurality of die associated therewith;

the pick head operable to, via a vacuum, pick up a die to be processed;

a cylindrical shroud coupled to the die attach tool and surrounding the pick head;

a vacuum exhaust coupled to a sidewall of the cylindrical shroud and operable to redirect air leakage generated from a bond force pressure chamber within the shroud away from a top surface of the die to be processed and out of the shroud; and

wherein the vacuum exhaust is positioned above the die to be processed.

18. The system of claim 17, wherein the die to be processed is a portion of a digital micro-mirror device.

19. The system of claim 17, wherein the die to be processed is a portion of an unprotected die.

20. The system of claim 17, wherein the cylindrical shroud is formed from aluminum.