Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same

• US 20070049064A1
• Filed: 11/30/2005
• Published: 03/01/2007
• Est. Priority Date: 08/30/2005
• Status: Active Grant

• Current Assignee: HannStar Display Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Ho, Jia-Chong, Hu, Tarng-Shiang, Cheng, Hsiang-Yuan
• Granted Patent: US 7,444,733 B2
• Time in Patent Office: Days
• US Class Current: 439/67
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2203/016 Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 : with component orienting
• CPC Class Codes: Y10T 29/49135 : and shaping, e.g., cutting or bending, etc.

Abstract

Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.

Claims

1. An alignment precision enhancement method of an electronic component process on a flexible substrate, comprising steps of:

placing said flexible substrate on a substrate holder;

completely sticking said flexible substrate by a polymer tape using a press machine, thereby said flexible substrate is adhesively fixed on said substrate holder through said polymer tape;

setting up a plural of alignment mark areas and removing said polymer tape within those alignment mark areas;

depositing or printing an metal or oxide layer on said polymer tape and on said alignment mark areas;

making a plural of alignment marks within those alignment mark areas;

making an electronic component on said polymer tape of the flexible substrate; and

separating said flexible substrate from said substrate holder using an unstressed cutting machine.

2. The method according to claim 1, wherein said substrate holder is made of glass, quartz, metal or ceramic.

3. The method according to claim 1, wherein said flexible substrate is a polymer substrate, an organic and inorganic mixed substrate, a metal substrate or a glass substrate.

4. The method according to claim 1, wherein the press machine carries out the adhesion in a roll-to-roll manner.

5. The method according to claim 1, wherein said polymer tape is made of polymer or an organic/inorganic mixed polymer complex material.

6. The method according to claim 1, wherein said alignment marks are made by a lithographic process.

7. The method according to claim 1, wherein the width of said electronic component is smaller than that of said polymer tape and of said flexible substrate.

8. An alignment precision enhancement method of an electronic component process on a flexible substrate, comprising steps of:

making a groove on a substrate holder-and placing said flexible substrate in said indentation;

completely sticking said flexible substrate by a polymer tape using a press machine, thereby said flexible substrate is adhesively fixed on said substrate holder through said polymer tape

setting up a plural of alignment mark areas and removing said polymer tape within those alignment mark areas;

depositing or printing an metal or oxide layer on said polymer tape and on said alignment mark areas;

making a plural of alignment marks within those alignment mark areas;

making an electronic component on said polymer tape of the flexible substrate; and

separating said flexible substrate from said substrate holder using an unstressed cutting machine.

9. The method according to claim 9, wherein said substrate holder is made of glass, quartz, metal or ceramic.

10. The method according to claim 9, wherein said flexible substrate is a polymer substrate, an organic and inorganic mixed substrate, a metal substrate or a glass substrate.

11. The method according to claim 9, wherein the press machine carries out the adhesion in a roll-to-roll manner.

12. The method according to claim 9, wherein said polymer tape is made of polymer or an organic/inorganic mixed polymer complex material.

13. The method according to claim 9, wherein said alignment marks are made by a lithographic process.

14. The method according to claim 9, wherein the width of said electronic component is smaller than that of said polymer tape and of said flexible substrate.

15. An alignment precision enhancement device of an electronic component process on a flexible substrate, comprising:

a substrate holder for carrying said flexible substrate;

a press machine for completely sticking said flexible substrate on said substrate holder by a polymer tape; and

an unstressed cutting machine for performing an unstressed cut according to positions of a plural of alignment marks and along the width of said flexible substrate so as to separate said flexible substrate from said substrate holder.

17. The device according to claim 17, wherein said flexible substrate is a polymer substrate, an organic and inorganic mixed substrate, a metal substrate or a glass substrate.

16. The device according to claim 17, wherein said substrate holder is made of glass, quartz, metal or ceramic.

18. The device according to claim 17, wherein said polymer tape is made of polymer or an organic/inorganic mixed polymer complex material.