ELECTRONIC MODULE AND METHOD FOR SEALING AN ELECTRONIC MODULE

• US 20070049121A1
• Filed: 08/28/2006
• Published: 03/01/2007
• Est. Priority Date: 08/26/2005
• Status: Active Grant

• Current Assignee: TK Holdings Incorporated (Ningbo Junsheng Investment Group Co., Ltd.)
• Original Assignee: Automotive Systems Laboratory, Incorporated (Ningbo Junsheng Investment Group Co., Ltd.)
• Inventors: Steele, Ryan
• Granted Patent: US 7,433,197 B2
• Time in Patent Office: Days
• US Class Current: 439/630
• CPC Class Codes: B60R 16/0231 Circuits relating to the driving or the functioning of the vehicle monitoring tyres B60C23/00; indicating overspeed B60K31/00; for dash boards B60K37/00, B60Q3/10; for indicating emergencies B60Q1/52; brake control systems B60T; registering or indicating the working of vehicles G07C5/00; measuring distance G01C, e.g. combinations of speed and distance G01C23/00; engine indicators G01L; measuring speed or acceleration G01P
• CPC Class Codes: H01R 13/52 Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 13/6683 with built-in sensor
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0078 specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
• CPC Class Codes: H05K 5/064 sealed by potting, e.g. waterproof resin poured in a rigid casing

Abstract

A method and apparatus for sealing electronic module conductors is provided. Electronic modules typically consist of an electronic circuit board (“PCB”) with electronic components, an integral housing/connector assembly, conductors such as wires or terminal pins, and a mounting feature. A method for sealing electronic module conductors is provided which improves the sealing properties around the conductors positioned on the first and second side of the PCB.

Claims

1. An electronic module, comprising:

an electronic module housing; and

a printed circuit board, having a first and a second side and a leak path, wherein a potting well is formed in the electronic module housing beneath the leak path.

2. The electronic module of claim 1, wherein the leak path is positioned between an edge of the printed circuit board and a surface of the electronic module housing.

3. The electronic module of claim 1, wherein the leak path is formed as a hole in the printed circuit board.

4. The electronic module of claim 1, wherein the conductors are terminal pins arranged to pass through the printed circuit board.

5. The electronic module of claim 1, wherein the conductors are wires soldered to the printed circuit board.

6. The electronic module of claim 1, wherein the electronic module is a crash sensor configured to sense a vehicle impact and deploy an airbag.

7. The electronic module of claim 1, further comprising conductors connected to the housing and the printed circuit board such that the conductors are positioned in the potting well and are exposed on the first side of the printed circuit board.

8. The electronic module of claim 7, further comprising a potting material dispensed on the first side of the printed circuit board, dispensed in the leak path, and dispensed in the potting well.

9. The electronic module of claim 8, wherein a plurality of circuit components are positioned on the first and/or second side of the printed circuit board.

10. The electronic module of claim 9, wherein the potting well encloses the conductors positioned on the second side of the printed circuit board and prevents the circuit components positioned on the second side of the printed circuit board from being exposed to the potting material.

11. A method for sealing an electronic module, comprising:

providing an electronic module housing, having a potting well;

placing a printed circuit board into the electronic module housing, such that a leak path is formed above the potting well; and

dispensing a potting material on the first side of the printed circuit board such that the potting material flows down the leak path and into the potting well.

12. The method for sealing an electronic module as claimed in claim 11, wherein the leak path is formed between an edge of the printed circuit board and a surface of the electronic module housing.

13. The method for sealing an electronic module as claimed in claim 11, wherein the leak path is formed as a hole in the printed circuit board.

14. The method for sealing an electronic module as claimed in claim 11, wherein conductors are connected to the electronic module housing and the printed circuit board such that the conductors are positioned in the potting well and are exposed on the first side of the printed circuit board.

15. The method for sealing an electronic module as claimed in claim 11, wherein the conductors are terminal pins arranged to pass through the printed circuit board.

16. The method for sealing an electronic module as claimed in claim 11, wherein the conductors are wires and are soldered to the printed circuit board.

17. The method for sealing an electronic module as claimed in claim 11, wherein the electronic module is a crash sensor configured to sense a vehicle impact and deploy an airbag.

18. The method for sealing an electronic module as claimed in claim 11, wherein a plurality of circuit components are positioned on the first and/or second side of the printed circuit board.

19. The method for sealing an electronic module as claimed in claim 18, wherein the potting well encloses the conductors positioned on the second side of the printed circuit board and prevents the circuit components positioned on the second side of the printed circuit board from being exposed to the potting material.