Mechanical quantity sensor

• US 20070051182A1
• Filed: 09/05/2006
• Published: 03/08/2007
• Est. Priority Date: 09/06/2005
• Status: Abandoned Application

• Current Assignee: Seiko Instruments Incorporated (Seiko Group)
• Original Assignee: Seiko Instruments Incorporated (Seiko Group)
• Inventors: Uchiyama, Takeshi, Egawa, Akira, Yarita, Mitsuo
• Application Number:
  US11/515,649
• Publication Number:
  US 20070051182A1
• Time in Patent Office: Days
• US Class Current: 73/777
• CPC Class Codes: G01P 15/0922 of the bending or flexing mode type
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

Abstract

Detection accuracy of a sensor is improved by reducing an influence of an exogenous noise. Acceleration acting on an object is detected based on a change of posture of a mass part supported by a flexible substrate. The flexible substrate is fixed at a frame and the mass part is fixed by soldering at the center thereof. When a force such as acceleration acts on the mass part, the posture of the mass part changes and the flexible substrate also becomes deformed. The change of posture of the mass part and the deformation of the flexible substrate are detected based on the amount of change of a circuit constant of a piezoresistive element as a detecting element provided at a beam part. A signal processing circuit for processing a signal detected by the detecting element is formed on an IC chip, by which the mass part is configured. Configuration of the mass part by the IC chip makes, it possible to configure so that a distance between the signal processing circuit and the detecting element can be short and to reduce an influence of an exogenous noise.

Claims

1. A mechanical quantity sensor comprising:

a frame;

a movable part including a flexible part fixed at the frame and a mass part which is supported by the flexible part and whose posture changes with an action of an external force;

a detecting element at least a part of which is provided at the movable part;

a detecting means provided at the movable part and for detecting the change of posture of the mass part based on a change of a circuit constant of the detecting element; and

a converting means for converting the change of posture of the mass part detected by the detecting means into a mechanical quantity.

2. A mechanical quantity sensor according to claim 1, wherein the detecting means is formed at the mass part.

3. A mechanical quantity sensor according to claim 1, wherein the detecting element includes a piezoresistive element provided at the flexible part.

4. A mechanical quantity sensor according to claim 2, wherein the detecting element includes a piezoresistive element provided at the flexible part.

5. A mechanical quantity sensor according to claim 1, wherein the detecting element includes a capacitive element in which an electrode on one side is provided at the movable part.

6. A mechanical quantity sensor according to claim 2, wherein the detecting element includes a capacitive element in which an electrode on one side is provided at the movable part.

7. A mechanical quantity sensor according to claim 1, wherein the detecting element includes a piezoelectric element provided at the flexible part.

8. A mechanical quantity sensor according to claim 2, wherein the detecting element includes a piezoelectric element provided at the flexible part.

9. A mechanical quantity sensor according to claim 1, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

10. A mechanical quantity sensor according to claim 2, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

11. A mechanical quantity sensor according to claim 3, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

12. A mechanical quantity sensor according to claim 4, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

13. A mechanical quantity sensor according to claim 5, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

14. A mechanical quantity sensor according to claim 6, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

15. A mechanical quantity sensor according to claim 7, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

16. A mechanical quantity sensor according to claim 8, wherein the mass part includes a semiconductor chip with at least the detecting means formed.

17. A mechanical quantity sensor according to claim 9, wherein the semiconductor chip and the flexible part are provided with a fixed pad pairing each other and are bonded to each other by flip chip bonding or wire bonding through the fixed pad.

18. A mechanical quantity sensor according to claim 10, wherein the semiconductor chip and the flexible part are provided with a fixed pad pairing each other and are bonded to each other by flip chip bonding or wire bonding through the fixed pad.

19. A mechanical quantity sensor according to claim 17, wherein the fixed pad is provided at a position where a mass is distributed so as to keep a mass balance of the mass part.

20. A mechanical quantity sensor according to claim 18, wherein the fixed pad is provided at a position where a mass is distributed so as to keep a mass balance of the mass part.