Methods and apparatus for stripping
First Claim
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1. A stripping reactor that comprises:
- a remote plasma source disposed to output a gas;
a gas distribution plate connected to ground that transmits the gas output from the remote plasma source to a processing chamber;
a wafer support disposed in the processing chamber;
a wafer support assembly disposed about the wafer support that includes an outer conductive peripheral structure connected to ground; and
an RF power supply connected to supply RF power to the wafer support.
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Abstract
One embodiment of the present invention is a stripping reactor that includes: (a) a remote plasma source disposed to output a gas; (b) a gas distribution plate connected to ground that transmits the gas output from the remote plasma source to a processing chamber; (c) a wafer support disposed in the processing chamber; (d) a wafer support assembly disposed about the wafer pedestal that includes an outer conductive peripheral structure connected to ground; and (e) an RF power supply connected to supply RF power to the wafer support.
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Citations
34 Claims
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1. A stripping reactor that comprises:
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a remote plasma source disposed to output a gas;
a gas distribution plate connected to ground that transmits the gas output from the remote plasma source to a processing chamber;
a wafer support disposed in the processing chamber;
a wafer support assembly disposed about the wafer support that includes an outer conductive peripheral structure connected to ground; and
an RF power supply connected to supply RF power to the wafer support. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A plasma processing reactor for processing a wafer to fabricate at least a portion of an integrated circuit that comprises:
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a grounded gas distribution plate that transmits gas into a processing chamber;
a wafer support to support the wafer;
a wafer support assembly disposed about the wafer support that includes an outer conductive peripheral structure connected to ground; and
an RF power supply that supplies RF power to the wafer support. - View Dependent Claims (32, 33, 34)
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Specification