×

Methods and apparatus for stripping

  • US 20070051471A1
  • Filed: 10/04/2002
  • Published: 03/08/2007
  • Est. Priority Date: 10/04/2002
  • Status: Abandoned Application
First Claim
Patent Images

1. A stripping reactor that comprises:

  • a remote plasma source disposed to output a gas;

    a gas distribution plate connected to ground that transmits the gas output from the remote plasma source to a processing chamber;

    a wafer support disposed in the processing chamber;

    a wafer support assembly disposed about the wafer support that includes an outer conductive peripheral structure connected to ground; and

    an RF power supply connected to supply RF power to the wafer support.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×