X-ray detector

• US 20070051894A1
• Filed: 12/02/2004
• Published: 03/08/2007
• Est. Priority Date: 12/10/2003
• Status: Active Grant

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Overdick, Michael, Rutten, Walter, Nascetti, Augusto
• Granted Patent: US 7,521,683 B2
• Time in Patent Office: Days
• US Class Current: 250/370.90
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14658 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 5/32 Transforming X-rays cameras or camera modules for generating image signals from X-rays H04N23/30; circuitry of SSIS for transforming X-rays into image signals H04N25/30

Abstract

The invention relates to a detector for an X-ray apparatus, which detector comprises a substrate (1) of amorphous or preferably crystalline silicon with an array (2) of sensor element (3) disposed thereon. Integrated electronic modules (4) having analog-digital converters disposed thereon are mounted on one edge (5) of the substrate (1) by flip-chip contacting or the like and are connected by way of signal leads (6) to the sensor elements. The modules (4) and/or the substrate can additionally comprise amplifiers and multiplexers for processing the sensor signals.

Claims

1. A detector for an imaging device, comprising

a) a substrate (1);

b) an array (2) of sensor elements (3), which is formed on one side of the substrate (1);

c) at least one integrated electronic module (4) for processing sensor signals, the module (4) being mounted at one edge (5) of the substrate (1) and being connected at its input side to the sensor elements (3), and the module (4) comprising at least one analog-digital converter for conversion of analog input signals into digital output signals.

2. A detector as claimed in claim 1, characterized in that the substrate (1) comprises amplifiers for amplifying the input signals of the integrated module (4).

3. A detector as claimed in claim 1, characterized in that the substrate (1) comprises multiplexers connected upstream of the integrated module (4) and/or connected downstream of the integrated module (4).

4. A detector as claimed in claim 1, characterized in that the integrated module (4) comprises at least one amplifier for amplifying the input signals and/or comprises at least one multiplexer.

5. A detector as claimed in claim 1, characterized in that the integrated module (4) is manufactured from crystalline silicon.

6. A detector as claimed in claim 1, characterized in that the array (2) of sensor elements (3) extends at three sides right up to the edge of the substrate (1).

7. A detector as claimed in claim 1, characterized in that the integrated module (4) is connected to the substrate (1) by flip-chip contacting, by wire-bonding or by mounting of packaged ICs on a wafer.

8. A detector as claimed in claim 1, characterized in that the substrate (1) comprises electronics of crystalline or amorphous silicon.

9. A detector as claimed in claim 1, characterized in that the sensor elements (3) are sensitive to X-radiation and/or visible light.

10. An imaging device, especially an X-ray apparatus, characterized by a detector as claimed in claim 1.