LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

• US 20070051966A1
• Filed: 08/31/2006
• Published: 03/08/2007
• Est. Priority Date: 09/02/2005
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Higashi, Mitsutoshi, Shiraishi, Akinori, Taguchi, Yuichi, Sakaguchi, Hideaki
• Granted Patent: US 7,622,317 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 33/504 : Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 : the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting diode includes an LED element, a fluorescent material provided so as to cover the LED element, a substrate on which the LED element is mounted and made of ceramics or silicon, and a pair of electrode pads which are electrically connected to the LED element on the substrate.

Claims

1. A light emitting diode (LED) comprising:

an LED element;

a fluorescent material element provided so as to cover the LED element;

a substrate on which the LED element is mounted; and

a pair of electrode pads which are provided on the substrate and connected electrically to the LED element.

2. The light emitting diode according to claim 1, wherein the substrate is made of ceramics or silicon.

3. The light emitting diode according to claim 1, wherein the fluorescent material element includes a plurality of fluorescent materials which emit light in different colors.

4. A method of manufacturing a light emitting diode (LED), comprising:

forming a pair of electrode pads on a substrate on which an LED element is mounted;

connecting the LED element to the pair of electrode pads electrically;

measuring a luminance of the LED and a wavelength of the LED by applying a voltage to the pair of electrode pads so as to make the LED element emit light; and

forming a fluorescent material element based on results of the measurement of the luminance and the wavelength so that the luminance and the wavelength of the LED become a predetermined luminance and a predetermined wavelength, the fluorescent material element covering the LED element.

5. The method of manufacturing a light emitting diode according to claim 4, wherein the measurement of the luminance and the wavelength and the formation of the fluorescent material element are performed simultaneously.

6. A method of manufacturing a light emitting diode according to claim 4,

wherein the fluorescent material element is two-layered, and

the method further comprising:

forming a first layer of the fluorescent material member so as to cover the LED element;

measuring the luminance and the wavelength of the LED in which the first layer of the fluorescent material member is formed; and

forming a second layer of the fluorescent material member based on results of the measurement of the luminance and the wavelength of the LED in which the first layer of the fluorescent material member is formed, so that the luminance and the wavelength of the LED become a predetermined luminance and a predetermined wavelength.

7. The method of manufacturing a light emitting diode according to claim 6, wherein the formation of the second layer of the fluorescent material member includes measuring the luminance and the wavelength of the LED by applying a voltage to the pair of electrode pads so as to make the LED element emit light.

8. The method of manufacturing a light emitting diode according to claim 4, wherein the substrate is made of ceramics or silicon.

9. The method of manufacturing a light emitting diode according to claim 6, wherein the first layer of the fluorescent material is formed by a printing method.