Integrated circuit device

• US 20070052088A1
• Filed: 08/16/2006
• Published: 03/08/2007
• Est. Priority Date: 09/02/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Tsurume, Takuya, Kusumoto, Naoto
• Granted Patent: US 7,723,842 B2
• Time in Patent Office: Days
• US Class Current: 257/707
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

To solve the problems caused by accumulation of heat generated from an integrated circuit. The integrated circuit device of the invention includes a substrate over one surface of which an integrated circuit is formed. The other surface of the substrate (a surface over which the integrated circuit is not formed) includes a depressed portion and has a larger surface area than the one surface. The depressed portion formed on the other surface of the substrate is filled with a heat sink material, or a film containing a heat sink material is formed at least over the surface of the depressed portion. Such integrated circuit devices may be provided in a multilayer structure.

Claims

1. An integrated circuit device comprising:

a substrate;

an integrated circuit formed over one surface of the substrate; and

a depressed portion formed at the other surface of the substrate,

wherein the other surface has a larger surface area than the one surface, and

wherein the depressed portion contains a heat sink material.

9. The integrated circuit device according to any one of claims 1 to 8, wherein the heat sink material has a higher thermal conductivity than the substrate.

10. The integrated circuit device according to any one of claims 1 to 8, wherein the substrate is one of a glass substrate and a quartz substrate, and wherein the heat sink material has a thermal conductivity of 2 W/(m·

K) or more at 20°

C.

11. The integrated circuit device according to any one of claims 1 to 8, wherein the substrate is one of a glass substrate and a quartz substrate, and wherein the heat sink material has a thermal conductivity of 10 W/(m·

K) or more at 20°

C.

12. The integrated circuit device according to any one of claims 1 to 8, wherein the substrate is one of a glass substrate and a quartz substrate, and wherein the heat sink material has a thermal conductivity of 100 W/(m·

K) or more at 20°

C.

13. The integrated circuit device according to any one of claims 1 to 8, wherein the substrate is a Si substrate, and wherein the heat sink material has a thermal conductivity of 150 W/(m·

K) or more at 20°

C.

14. The integrated circuit device according to any one of claims 1 to 8, wherein the substrate is a Si substrate, and wherein the heat sink material has a thermal conductivity of 200 W/(m·

K) or more at 20°

C.

15. The integrated circuit device according to any one of claims 1 to 8, wherein the substrate has a thickness of 100 μ

m or less.

16. The integrated circuit device according to any one of claims 1 to 8, wherein the integrated circuit device is incorporated in one selected from the group consisting of a television receiver, a digital camera, a video camera, a computer, a mobile telephone, an image reproducing device, an electronic book, and an IC card.

2. An integrated circuit device comprising:

a plurality of substrates stacked with each other;

an integrated circuit formed over one surface of each of the plurality of substrates; and

a depressed portion formed at the other surface of each of the plurality of substrates,

wherein the other surface has a larger surface area than the one surface, and

wherein the depressed portion contains a heat sink material.

3. An integrated circuit device comprising:

a substrate;

an integrated circuit formed over one surface of the substrate; and

a depressed portion formed at the other surface of the substrate,

wherein the other surface has a larger surface area than the one surface, and

wherein a film containing a heat sink material is formed over at least a surface of the depressed portion.

4. An integrated circuit device comprising:

a plurality of substrates stacked with each other;

an integrated circuit formed over one surface of each of the plurality of substrates; and

a depressed portion formed at the other surface of each of the plurality of substrates,

wherein the other surface has a larger surface area than the one surface, and

wherein a film containing a heat sink material is formed over at least a surface of the depressed portion.

5. An integrated circuit device comprising:

a plurality of substrates stacked with each other;

an integrated circuit formed over one surface of each of the plurality of substrates; and

a depressed portion formed at the other surface of each of the plurality of substrates,

wherein the other surface has a larger surface area than the one surface,

wherein the depressed portion contains a heat sink material, and

wherein each of the plurality of substrates includes a heat dissipation portion.

6. An integrated circuit device comprising:

a plurality of substrates stacked with each other;

an integrated circuit formed over one surface of each of the plurality of substrates; and

a depressed portion formed at the other surface of each of the plurality of substrates,

wherein the other surface has a larger surface area than the one surface,

wherein a film containing a heat sink material is formed over at least a surface of the depressed portion, and

wherein each of the plurality of substrates includes a heat dissipation portion.

7. An integrated circuit device comprising:

a plurality of substrates stacked with each other;

an integrated circuit formed over one surface of each of the plurality of substrates; and

a depressed portion formed at the other surface of each of the plurality of substrates,

wherein the other surface has a larger surface area than the one surface,

wherein the depressed portion contains a heat sink material, and

wherein a part of the plurality of substrates includes a heat dissipation portion.

8. An integrated circuit device comprising:

a plurality of substrates stacked with each other;

an integrated circuit formed over one surface of each of the plurality of substrates; and

a depressed portion formed at the other surface of each of the plurality of substrates,

wherein the other surface has a larger surface area than the one surface,

wherein a film containing a heat sink material is formed over at least a surface of the depressed portion, and

wherein a part of the plurality of substrates includes a heat dissipation portion.