Radio frequency identification transponder antenna

• US 20070052613A1
• Filed: 09/23/2005
• Published: 03/08/2007
• Est. Priority Date: 09/06/2005
• Status: Active Grant

• Current Assignee: Smartrac Technology GmbH (Avery Dennison Corporation)
• Original Assignee: SMARTRAC TECHNOLOGY Dresden GmbH (OEP Technologie BV)
• Inventors: Ruprecht, Harald, Gallschuetz, Sebastian
• Granted Patent: US 7,696,947 B2
• Time in Patent Office: Days
• US Class Current: 343/860
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

A RFID transponder having a microchip or integrated circuit, an impedance-matching structure and a resonant structure mounted on at least one substrate and connected to each other by an electric field.

Claims

1. A RFID transponder, comprising:

a microchip;

an impedance-matching structure electrically connected to the microchip; and

a resonant structure connected to the microchip and the impedance-matching structure by an electric field.

2. The transponder of claim 1, further comprising at least one substrate for mounting at least one of the microchip, the impedance-matching structure and the resonant structure.

3. The transponder of claim 2, wherein the impedance-matching structure is of loop-shaped configuration.

4. The transponder of claim 2, wherein the impedance-matching structure and the resonants structure are mounted on separate substrates.

5. The transponder of claim 2, wherein the impedance-matching structure and the resonant structure are mounted on the same side of the substrate.

6. The transponder of claim 2, wherein the impedance-matching structure and the resonant structure are mounted on opposite sides of the substrate.

7. The transponder of claim 2, wherein the resonant structure comprises the substrate for mounting the impedance-matching structure.

8. The transponder of claim 7, wherein the impedance matching structure is fabricated by a stamping operation.

9. The transponder of claim 7, wherein the impedance-matching structure is formed as one of a stamped bent component or wire.

10. The transponder of claim 7, wherein the resonant structure comprises a cavity for receiving the impedance-matching structure.

11. The transponder of claim 1, wherein the resonant structure comprises an element of an object and wherein the resonant-matching structure is arranged on the object.

12. The transponder of claim 1, wherein the resonant structure and the impedance-matching structure are fabricated from materials selected from the group of metal, electrically conductive polymeric resin, paint and electrically conductive particles.

13. The transponder of claim 1, wherein the substrate comprises a flexible material.

14. The transponder of claim 1, wherein the substrate is fabricated from materials selected from the group of polymeric film, paper, textile, rubber, leather and flexible composite material.