Method for applying resin film to face of semiconductor wafer

• US 20070054498A1
• Filed: 09/05/2006
• Published: 03/08/2007
• Est. Priority Date: 09/06/2005
• Status: Active Grant

• Current Assignee: Disco Corporation
• Original Assignee: Disco Corporation
• Inventors: Iizuka, Kentaro, Kitahara, Nobuyasu, Sampei, Takashi, Yamashita, Yohei
• Granted Patent: US 7,799,700 B2
• Time in Patent Office: Days
• US Class Current: 438/758
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: Y10S 438/906 Cleaning of wafer as interim step

Abstract

A method for applying a resin film to the face of a semiconductor wafer, comprising: an assembly holding step of holding an assembly on the surface of chuck means, with the back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to the back of the frame and the back of the semiconductor wafer; a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto the face of the semiconductor wafer in the assembly after the assembly holding step; and a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer. The method further comprises a cleaning step of rotating the chuck means and also supplying a cleaning fluid to the surface of the frame after the spreading step, thereby cleaning the solution which has adhered to the surface of the frame.

Claims

1. A method for applying a resin film to a face of a semiconductor wafer, comprising:

an assembly holding step of holding an assembly on a surface of chuck means, with a back of the assembly being opposed to the surface of the chuck means, the assembly including a frame having a mounting opening formed in a central portion of the frame, and a semiconductor wafer mounted in the mounting opening of the frame by sticking a mounting tape to a back of the frame and a back of the semiconductor wafer;

a liquid droplet supply step of supplying liquid droplets of a solution having a resin dissolved therein onto a face of the semiconductor wafer in the assembly after the assembly holding step; and

a spreading step of rotating the chuck means subsequently to the liquid droplet supply step, thereby spreading the liquid droplets throughout the face of the semiconductor wafer,

the method further comprising a cleaning step of rotating the chuck means and also supplying a cleaning fluid to a surface of the frame after the spreading step, thereby cleaning the solution which has adhered to the surface of the frame.

2. The method according to claim 1, wherein the cleaning fluid is pure water.

3. The method according to claim 1, wherein in the cleaning step, the chuck means is rotated at 1 to 100 rpm.

4. The method according to claim 3, wherein in the cleaning step, the cleaning fluid is supplied for 5 to 30 seconds at a pressure of 0.1 to 0.3 MPa at a rate of 10 to 100 ml/min.